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edits
Changes
→Brazed Semi-Finished Contact Materials (Toplay–Profiles)
*Typical configurations of toplay contact profiles (<xr id="fig:Typical configurations of toplay contact profiles2"/>)
*Contact materials <br />Ag, AgNi 0,15 (ARGODUR), AgCu, AgCuNi (ARGODUR 27), Ag/Ni (SINIDUR), Ag/SnO<sub>2</sub> and Ag/ZnO<br />
*Carrier materials: Cu, CuZn, CuSn et al.<br />
*Typical configurations of multi-layer contact profiles (<xr id="fig:Typical configurations of multi-layer contact profiles"/>)
*Contact materials <br />Au-Alloys, Pd-Alloys, Ag-Alloys, Ag/Ni, Ag/SnO<sub>2</sub>, Ag/ZnO<br />
*Dimensions and tolerances (<xr id="fig:Contact Profiles Dimensions and tolerances"/>)
The thickness of the Au top-layer, which is sputtered for example, is between 0.2 and 5 μm, depending on the requirements. Tolerance of thickness is about ± 10%.
<div class="multiple-images">
<figure id="fig:Typical configurations of multi-layer contact profiles">
[[File:Typical configurations of multi-layer contact profiles.jpg|right|thumb|Figure 8: Typical configurations of multi-layer contact profiles]]
</figure>
<figure id="fig:Contact Profiles Dimensions and tolerances">
[[File:Contact Profiles Dimensions and tolerances.jpg|right|thumb|Figure 9: Contact Profiles Dimensions and tolerances]]
</figure>
==References==