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→7.1.1.1.2 Non-Precious Metal Electrolytes
The most important non-precious metals that are deposited by electroplating are: Copper, nickel, tin, and zinc and their alloys. The deposition is performed in the form of pure metals with different electrolytes used ''(Table 7.4)''.
*Copper electrolytes <br>Copper electrolytes are used for either depositing an intermediate layer on strips or parts, for building up a printed circuit board structure, or for the final strengthening during the production of printed circuit boards.< br/>
*Tin electrolytes <br>Pure tin and tin alloy deposits are used as dull or also bright surface layers on surfaces required for soldering. In the printed circuit board manufacturing they are also utilized as an etch resist for the conductive pattern design after initial copper electroplating.< br/>
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*Nickel electrolytes <br>Nickel layers are mostly used as diffusion barriers during the gold plating of copper and copper alloys or as an intermediate layer for tinning< br/>
*Bronze electrolytes <br>Bronze coatings – in white or yellow color tones – are used either as an allergy free nickel replacement or as a surface layer for decorative purposes. For technical applications the bronze layers are utilized for their good corrosion resistance and good brazing and soldering properties.< br/>
Table 7.2: Typical Electrolytes for the Deposition of Non-Precious Metals