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→7.1.1.1.2 Non-Precious Metal Electrolytes
*Tin electrolytes < br/>Pure tin and tin alloy deposits are used as dull or also bright surface layers on surfaces required for soldering. In the printed circuit board manufacturing they are also utilized as an etch resist for the conductive pattern design after initial copper electroplating.
'''Table 7.3: Precious Metal Electrolytes for Decorative Applications''' <figtable id="tab:Precious Metal Electrolytes for Technical Applications">'''Table 7.2: Precious Metal Electrolytes for Technical Applications''' {| class="twocolortable" style="text-align: left; font-size: 12px"|-!Type of Electrolyte !pH-Range!colspan="2" style="text-align:center"|Deposit Properties Hardness !Areas of Application|-!!!HV!Purity [kt] !|-|colspan="5" |'''Gold electrolytes'''|-|AUROMET TN|3.2 - 4.2|ca. 70|99.99% Au|Base-deposits|-|AUROMET XPH|0.3 - 0.6|160 - 180|99.8% Au|Base-deposits for stainless steel etc.|-|DODUREX COC|4.6 - 4.9|160 - 180|99.6% Au|Printed circuit boards, connectors, contact parts, etc.;<br />hard gold coatings for rack and barrel plating|-|DODUREX HS 100|4.3 - 4.6|160 - 180|99.6% Au|High speed process for connectors and PCB plating|-|PURAMET 202<br />PURAMET 402|5.5 - 6.5<br />7.0 - 7.5|60 - 80<br />60 - 80|99.99% Au<br />99.99% Au|High purity gold coatings for electrical and electronic parts incl. semi<br />conductors and PCBs; for demanding requirement on bonding properties|-|colspan="5" |'''Platinum metal electrolytes'''|-|RHODOPLAT T|strongly acidic|900|99.0% Rh|Ductile rhodium deposits for thicker layers, reed contacts, sliding contacts|-|RUTHENIUMBAD|stronglyacidic|900|99.0% Ru|Crack free thick ruthenium deposits|-|PLATINBAD 5|stronglyacidic|240 - 260|99.9% Pt|High temperature switching devices, etc|-|DODUPAL 3|7.0 - 8.0|220 - 250|99.9% Pd|Thin palladium layers as diffusion barrier|-|DODUPAL 5|7.0 - 8.0|220 - 250|99.9% Pd|Connectors and contact parts|-|DODUPAL 10|8.0 - 8.5|350 - 400|80.0% Pd|Pd/Ni for connectors and contact parts|-|colspan="5" |'''Silver electrolytes'''|-|ARGOL 30|cyanidebased|a pprox. 90|99.9% Ag|rowspan="4" |Contact parts, connectors|-|ARGOL HS 100|approx. 9.0|90 - 120|99.9% Ag|-|ARGOL 2000|approx. 12.0|||-|ARGOL 400||160 - 180|</figtable>
*Nickel electrolytes < br/>Nickel layers are mostly used as diffusion barriers during the gold plating of copper and copper alloys or as an intermediate