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→Selective Electroplating
'''Electroplated Parts'''
<figure id="fig:Electroplated Parts">[[File:Electroplated Parts.jpg|left|Figure 1: Electroplated Parts]]</figure>
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Besides others the following layer parameters are typically monitored in-process and documented:
<figure id="fig:Brush Tampon plating cell">
[[File:Brush Tampon plating cell.jpg|right|thumb|Figure 1: Brush (or “Tampon”) plating cell; 1 Strip; 2 Anode; 3 Electrolyte feed; 4 Felt covered cell]]
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For special applications, such as for example electronic component substrates, a dot shaped precious metal coating is required. This is achieved with two belt masks running synchronous to the carrier material. One of these two masks has windows, which are open to the spot areas targeted for precious metal plating coverage.
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Copper, copper alloys, nickel, nickel alloys, stainless steel
[[File:Dimensions and Tolerances.jpg|left|Dimensions and Tolerances]]
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Mechanical properties and dimensional tolerances of the carrier materials follow the typical standards, i.e. DIN EN 1652 and 1654 for copper and copper alloys. Depending on the application, the following parameters are tested and recorded (see also: Electroplating of parts):