===10 Electromechanical Components===
Plastic molded or encapsulated components are of increasing importance due to rising requirements for smaller, lighter, and more compact designs with cost efficient pricing. Wherever mechanics and electronic electronics meet, electromechanical components can be used in a multitude of applications, such as in automotive, communications, appliance, and consumer electronics engineering.In automotive applications , such components are used in ever increasing volumes. In hybrid housings , electronic components are integrated into components for increasingly more complex engine management functions. Strip-molded contact parts are , for example , used for seat adjustment, and airbag sensors; assembled contact parts are important functional components among others for memory mirror positioning units.
Electromechanical components usually consist of stamped circuit patterns (lead frames) , which are coated in the contacting areas with functional surface layers. They serve as the electrical connections of the component to the outside wiring. The lead frames are over-molded with plastics or mounted into plastic molded parts. In addition , electronic components can be added to increase the level of product integration. Utilizing the metal–plastic compound , the mechanical stability of the plastic is combined with the conduction of electrical energy and electronic signals through the lead frame. In this way , protective enclosures for electronic controls of machinery are created which at the same time serve as connecting points to the outside wiring. This can be achieved through hybrid frames and housings. Over-molding of contact components or assembly of different single parts in plastic enclosures can also be used to manufacture electromechanical components.
For achieving the highest possible functionality of the end product , a close cooperation between the manufacturer and the end user in the early phases of development and design of new custom tailored electromechanical compo- nents components is recommended. Innovative and cost-efficient designs can be realized through the combination of the know-how of the manufacturer in for example contact, coating, stamping, plastics processing, and assembly technologies and the mostly rather complex requirement profile given by the end user.
Besides the contact components , the plastic materials are the critical building blocks for electromechanical components. The Plastics used , are mostly technical thermoplastics and heavy-duty plastics which fulfill the requirements for high mechanical strength, temperature stability, and fatigue strength ''(<xr id="tab:Frequently Used Plastic Materials and their Properties"/><!--(Table 10.1)''-->). For the final selection of a plastic material , economical considerations and the avoidance of environmentally hazardous ingredients , such as for example flame retardants , must be considered. The application of the most suitable contact material coating and the selection of carrier materials are covered in chapters 5, 7[[Contact Carrier Materials|Contact Carrier Materials]], [[Surface Coating Technologies| Surface Coating Technologies]] and 9[[Applications for Bonding Technologies|Applications for Bonding Technologies]].
<figtable id==="tab:Frequently Used Plastic Materials and their Properties"><caption>'''<!--Table 10.1 Hybrid Frames :-->Frequently Used Plastic Materials and Housings===their Properties'''</caption>
Hybrid frames and housings serve as the connecting points between mechanics and electronics ''(Fig. 10.1)''. They allow the transmission {| class="twocolortable" style="text-align: left; font-size: 12px"|-!rowspan="2" style="text-align:center;"| Type of signals or electrical energyPlastics:<br />Poly-condensate<br />Sub-Type: Thermo-<br />plastics Abbrev. The connection to the current paths inside the housing is mostly done by bonding with aluminum wires. The over!colspan="6" style="text-align:center; padding:2px"| Properties|-molded lead frames are typically manufactured from aluminum clad strip materials which are well suited for bonding. The connectors integrated into the housing for transferring the current paths to the outside are coated with tin, silver, or gold, depending on specific requirements.
Fig!Density<br />[g/cm<sup>3</sup>]!Reinforcement<br />Materials!mechanical!electrical!thermal!resistant against|-|'''PPS'''|1.34 - 1.64|glass fibers,<br />graphite fibers|very high mechanical strength and<br />stiffness even at high temperatures,<br />low toughness, very low creep,<br />better properties with addition of<br />40% glass fibers|excellent isolation<br />properties, very low<br />dielectric losses|usable up to 240°C, short term<br />up to 270°C, low combustibility,<br />self-extinguishing, non-dripping|up to 220°C no known solvents,<br />conc. sodium hydroxide,<br />conc. hydrochloric and sulfuric<br />acid, good hydrolysis resistance|-|'''PA6<br />PA66<br />PA610<br />PA11<br />PA12<br /> A amorph'''|1.12 - 1.14<br />1.13 - 1.14<br />1.06 - 1.08<br />1.04<br />1.01 - 1.02<br />1.06 - 1. 1012|glass fibers,<br />graphite fibers,<br />mineral powders,<br />glass beads, chalk,<br />lubricants such as<br />graphite, MoS<sub>2</sub>|depending on the PA type, crystalline<br />structure and water content; high<br />mechanical strength, stiffness, and<br />toughness; higher mech.strength<br />through stretching; very tough after<br />water absorption; high fatigue strength,<br />good impact toughness, abrasion<br />resistant, good sliding properties<br />through addition of graphite and MoS<sub>2</sub>;<br />increased mechanical strength with<br />glass and graphite fiber addition|depending on water<br />content, good surface<br />resistance reduces static<br />surface charge, high<br />dielectric losses, good<br />resistance against creep<br />currents|upper use temperature 80 – 120°C<br />depending on type, short term<br />up to 140 – 200°C, mostly<br />boil resistant, can be sterilized,<br />narrow softening range|aliphatic and aromatic<br />hydrocarbons, gasoline, oils,<br />greases, some alcohols, esters,<br />ketenes, ether,<br />many chlorinated hydrocarbons, <br />weak alkaline solutions|-|'''PBT'''|1: Component .29|glass fibers,<br />glass beads, minerals,<br />talcum |very high toughness at low<br />temperatures, good stiffness and<br />mechanical strength, good long term<br />stability, low abrasion at good sliding<br />properties|good isolation properties,<br />good dielectric strength,<br />little effect of humidity|good thermal stability, use<br />temperature 60 – 110°C, short<br />term higher, with hybrid housing glass<br />reinforcement up to 200°C, low<br />tendency to turn yellow, very low<br />thermal expansion, burns with<br />sooty flame and drips|aliphatic and aromatic<br />hydrocarbons, fuels, oils, greases|-|'''LCP'''|1.40 - 1.92|glass fibers,<br />minerals |very high precision and dimensional<br />stability, high stiffness at low wall<br />thickness, low thermal expansion<br />coefficient; reinforced, better sliding<br />ability, electrically conductive and<br />suitable for electroplating types|dielectric losses depend<br />on surface coating, good<br />electrical conductivity;<br />depending on type<br />suitable for anti-static<br />applications|use temperature 200 – 250°C,<br />good high temperature stability,<br />very low thermal expansion,<br />resistant to soldering<br />temperatures < 250°C, difficult to<br />combust and self-extinguishing|good resistance against widely<br />used organic solvents, i.e.<br />acetone, methanol, chlorine gas,<br />acetic acid|-|'''PPA'''|1.26 - 1.85|glass fibers,<br />minerals |high impact strength with good<br />mechanical strength and stiffness, very<br />high dimensional stability at high<br />temperatures, very low humidity<br />absorption|very low electrical losses|use temperature up to 185°C,<br />standard types with UL94-HB<br />classification, special flame<br />protective types|very good resistance against<br />typically used organic solvents, i.e.<br />acetone, methanol, etc., water<br />based solutions (DI water, 10%<br />ammonium hydride, typical liquids<br />used in automobilesthe automobile such as<br />brake fluid, motor oil, etc|}</figtable>
== Hybrid Frames and Housings==
Hybrid frames and housings serve as the connecting points between mechanics and electronics (<xr id==="fig:Component with hybrid housing for use in automobiles"/><!--(Fig. 10.2 Continuous Strip Over1)-->). They allow the transmission of signals or electrical energy. The connection to the current paths inside the housing is mostly done by bonding with aluminum wires. The over-Molding=molded lead frames are typically manufactured from aluminum clad strip materials, which are well suited for bonding. The connectors integrated into the housing for transferring the current paths to the outside, are coated with tin, silver or gold, depending on specific requirements.<figure id="fig:Component with hybrid housing for use in automobiles">[[File:Component with hybrid housing for use in automobiles.jpg|left|thumb|Figure 1: Component with hybrid housing for use in automobiles]]</figure><br style="clear:both;"/>
In strip form over== Continuous Strip Over-molded contact parts reduce the complexity of assembly of the finished product. This complexity constantly increases with adding additional subcomponents ''(Fig. 10.2)''.Molding==
The In strip form, over-molded contact parts can be tested for various quality parameters during manufacturing to continuously ensure reduce the ever increasing reliability requirements complexity of assembly of the end finished product. This complexity constantly increases with adding additional subcomponents (<xr id="fig:Examples of strip over molded contact components"/><!--(Fig. 10.2)-->).
Combining stamping and molding techniques in an automated production line allows the stamped The strip over-molded contact parts to can be molded into plastics as a complete functional unit. This also allows to reduce tested for various quality parameters during manufacturing tolerances , to levels below those achievable with conventional assembly methodscontinuously ensure the ever increasing reliability requirements of the end components.
FigCombining stamping and molding techniques in an automated production line allows the stamped contact parts to be molded into plastics as a complete functional unit. 10This also enables to reduce manufacturing tolerances to levels below those achievable with conventional assembly methods.<figure id="fig:Examples of strip over molded contact components">[[File:Examples of strip over molded contact components.jpg|left|thumb|Figure 2: Examples of strip over-molded contact components]]</figure><br style="clear:both;"/>
==Assembled Contact Components==For applications and materials which do not allow strip over-molding, semi or fully automated assembly processes can be utilized. Different single parts, like printed circuit boards, stamped parts or contact components are assembled together with plastic molded parts on specialized equipment to complete functional components with low tolerances and high levels of functionality (<xr id="fig:Examples of assembled contact components"/><!--(Fig. 10.3)-->). This also allows to integrate components which otherwise are difficult to mount onto circuit boards or carriers, such as capacitors, coils or sensor elements into the functional component assembly. Contact parts used in these components are already tested on the assembly machine for quality parameters and functionality.<figure id="fig:Examples of assembled contact components">[[File:Examples of assembled contact components.jpg|left|thumb|Figure 3: Examples of assembled contact components]]</figure>
===10.3 Assembled Contact Components===For applications and materials which do not allow strip over[[de:Kunststoff-molding, semi or fully automated assembly processes can be utilized. Different single parts like printed circuit boards, stamped parts, or contact components are assembled together with plastic molded parts on specialized equipment to complete functional components with low tolerances and high levels of functionality ''(Fig. 10.3)''. This also allows to integrate components which otherwise are difficult to mount onto circuit boards or carriers, such as capacitors, coils, or sensor elements into the functional component assembly. Contact parts used in these components are already tested on the assembly machine for quality parameters and functionality.Metall-Verbundteile]]