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Contact Carrier Materials

670 bytes added, 18:44, 17 March 2014
5.1.3 High Cu Content Copper Alloys
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<figtable id="tab:tab5.5">
'''Table 5.6; Mechanical Properties of Selected High Cu Content Copper Alloys'''
{| class="twocolortable" style="text-align: left; font-size: 12px"|-!Material!Hardness<br />Condition!Tensile Strength R<sub>m</sub><br />[MPa]!0,2 teile% YieldStrength<br />R<sub>p02</sub><br />[MPa]!Elongation<br />A<sub>50</sub><br />[%]!Vickers<br />Hardness<br />HV!Bend Radius<sup>1)</sup><br />perpendicular to<br />rolling direction!Bend Radius<sup>1)</sup><br />parallel to<br />rolling direction!Spring Bending<br />Limit FFB<br />[MPa]!Spring Fatigue<br />Limit FBW<br />[MPa]|-|CuAg0,10|R 200<br />R 360|200 - 250<br />360|120<br />320|> 40<br />> 3|40<br />90|0 x t<br />0.5 x t|0 x t<br />0.5 x t|240|120|}</figtable>
These newer copper based materials optimize properties such as electrical conductivity, mechanical strength, and relaxation, which are custom tailored to specific applications. Typical uses include contact springs for relays, switches, and connectors.