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Attachment of Single Contact Parts

47 bytes added, 17:12, 25 March 2014
Brazing Processes
materials in each other diffusion processes are thermally activated by which elements of the base material diffuse into the brazing alloy and elements of the braze alloy diffuse into brazing alloy. This increases the bond strength and therefore the mechanical stability of the brazed joint.
For attachment of contact parts to carrier base materials only brazing alloys (as opposed to solders) are used. The reason is the higher softening temperature and melting point as well as higher mechanical strength and electrical conductivity of these alloys. The brazing alloys and fluxes used for electrical contact attachment are listed in Chapter 4 [[Brazing Alloys and Fluxes|Brazing Alloys and Fluxes ]] in more detail. Following the most frequently used brazing methods are described.
References to the bond quality are given according to the test methods described in Chapter 3.4.