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Wire bonding is the manufacturing process for creating metallurgical bond connections between a thin wire (12.5 – 50 µm for gold fine-wires and 150 – 500 µm for aluminum thick-wires) and a suitably coated circuit carrier through friction welding. In principle this process consists of pressure welding with the aid of ultrasound. The metallurgical bond is mainly caused by frictional heat created through the relative movement between the two bonding partner materials. To achieve high reliability over longer time and under difficult environmental conditions high quality requirements regarding material and mechanical strength properties must be met by the surfaces of the bonding partners.
Multiple silicon chips are combined to a functional unit on a circuit carrier (for example PCB board, DCB substrate, thick film ceramic) which is mostly encased in a hybrid housing for environmental protection. The metallic conductors mounted inside the housing then serve as connections to the outside. If higher current carrying capacity is needed, as for example in power electronics, Al thick-wire bonding is employed <xr id="fig:Bond_connection_Al_thick_wire_on_clad_AlSi"/> <!--(Fig. 9.1)-->.
<figure id="fig:Bond_connection_Al_thick_wire_on_clad_AlSi">
[[File:Bond connection Al thick wire on clad AlSi.jpg|right|thumb|Bond connection: Al thick-wire on clad AlSi; (a) Macro photograph, b) micro structure with ruptured wire]]
== AlSi Clad Strip for Bond Connections==
Besides electroplated or chemically deposited gold coatings AlSi clad semi- finished materials are used for layered systems on circuit carriers and in hybrid housings (or for lead frames). These strip materials are manufactured by cold roll cladding of an AlSi1 alloy material onto Cu or Cu alloy strip (see chapter 3.2.1 [[Manufacturing_of_Semi-Finished_Materials|Manufacturing of Semi-Finished Materials]]).
To achieve a strong metallurgical bond between these two components a suitable surface preparation of the carrier strip and a high degree of deformation are required, followed by diffusion annealing of the clad strip.
== Electroless Metal Deposition on Printed Circuit Boards==
Printed circuit boards are also used as circuit carriers. Since many of the conductive structures are not electrically connected on the circuit board electroless processes are applied to create the final surface coatings (see chapter 7.1.2 [[Electroless_Plating|Electroless Plating]]). Besides bonding to Nickel/Gold surfaces soldering is the most widely used process to create conductive connections. This can also be performed on electroless deposited tin surface coatings.
<xr id="fig:Electroless deposition on a printed circuit board"/> <!--Fig. 9.2: --> Electroless deposition on a printed circuit board
<figure id="fig:Electroless deposition on a printed circuit board">
[[File:Electroless deposition on a printed circuit board.jpg|right|thumb|Electroless deposition on a printed circuit board]]