Printed circuit boards are also used as circuit carriers. Since many of the conductive structures are not electrically connected on the circuit board electroless processes are applied to create the final surface coatings Electroless_Plating (see chapter 7.1.2) [[Electroless_Plating|Electroless Plating]]. Besides bonding to Nickel/Gold surfaces soldering is the most widely used process to create conductive connections. This can also be performed on electroless deposited tin surface coatings.

<xr id="fig:Electroless deposition on a printed circuit board"/> '''Fig. 9.2: Electroless deposition on a printed circuit board'''

<figure id="fig:Electroless deposition on a printed circuit board">