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→AlSi Clad Strip for Bond Connections
== AlSi Clad Strip for Bond Connections==
Besides electroplated or chemically deposited gold coatings AlSi clad semi- finished materials are used for layered systems on circuit carriers and in hybrid housings (or for lead frames). These strip materials are manufactured by cold roll cladding of an AlSi1 alloy material onto Cu or Cu alloy strip (see chapter 3.2.1) [[Manufacturing_of_Semi-Finished_Materials|Manufacturing of Semi-Finished Materials]] (see chapter 3.2.1).
To achieve a strong metallurgical bond between these two components a suitable surface preparation of the carrier strip and a high degree of deformation are required, followed by diffusion annealing of the clad strip.