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Applications for Bonding Technologies

No change in size, 08:19, 15 December 2022
Wire Bonding
Multiple silicon chips are combined to a functional unit on a circuit carrier (for example PCB board, DCB substrate, thick film ceramic) which is mostly encased in a hybrid housing for environmental protection. The metallic conductors attached inside the housing then serve as the connection to the outside. If a higher current carrying capacity is required, such as in power electronics, the Al thick wire connection is used (<xr id="fig:Bond_connection_Al_thick_wire_on_clad_AlSi"/><!--(Fig. 9.1)-->).
<figure id="fig:Bond_connection_Al_thick_wire_on_clad_AlSi">
[[File:Bond connection Al thick wire on clad AlSi.jpg|right|thumb|Figure 13: Bond connection: Al thick-wire on clad AlSi; (a) Macro photograph, b) micro structure with ruptured wire]]
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