2,808
edits
Changes
→6.2 Contact Materials and Design of Contact Components
|Ag and Au alloys, Pd, PdNi; For automotive and consumer electronic at low operation numbers: Sn and Sn alloys
|Electroplated layers or clad, often Au flash plated, mostly with Ni substrate layer, stamped parts from hot tin dipped strip
|-
|Telecommunication relays
|Reliable contacting even at high operational frequency
|Ag, AgPd, Au alloys, PdRu
|Rivets, welded profile segments
|-
|Reed relay contacts
|High reliability at low currents independent of atmospheric environment
|Au, (Rh)
|Switch paddles FeNi with partially diffused Au, (electroplated Rh)
|-
|Relays in electronic circuits
|High reliability at low switching loads and compact device design
|Au alloys, AgPd, Ag alloys
|Stamped springs from seam-welded profiles, welded miniature profile (tape) segments, contact rivets
|}