Conductive adhesives are used mostly for mechanical bonding with low thermal impact. As the adhesive components high-polymer organic substances such as epoxy resins and mixed polymers are mostly used. They are made of electrical filler materials such as flake shaped silver powders (70 – 80 wt%). Silver based conductive adhesives are available as single or two component adhesive systems. Both types are hardening without the application of pressure.

The mechanical strength of the bond connections depends mostly on the selected hardening temperature (<xr id="fig:Shear force of an adhesive joint"/> <!--(Fig. 8.4)-->).

<figure id="fig:Shear force of an adhesive joint">