Stamped electrical contact parts typically consist of a base carrier material to which a contact material is attached by various methods <xr id="fig:Plated and contact containing pre-stamped strips and stamped partsPlated_and_contact_containing_pre_stamped_strips_and_stamped_parts"/> <!--(Fig. 3.17)-->. <figure id="fig:Plated and contact containing pre-stamped strips and stamped partsPlated_and_contact_containing_pre_stamped_strips_and_stamped_parts">

non-precious materials such as tin, nickel and copper <xr id="fig:Plated and contact containing pre-stamped strips and stamped parts"/> <!--(Fig. 3.17)-->.

For many applications thicker precious metal surfaces or AlSi layers are necessary. These cannot be deposited by electroplating. Besides meltmetallurgically produced materials on the basis of gold, palladium and silver, also powder-metallurgical materials are required frequently. The metallurgical bond between these contact materials and the mostly copper based substrates is achieved through various mechanical cladding methods (see also chapter [[Manufacturing of Semi-Finished Materials#Clad Semi-Finished Pre-Materials (Contact-Bimetals)| Clad Semi-Finished Pre-Materials (Contact-Bimetals)]]). In this way also aluminum clad strips are manufactured in which the aluminum layer serves as the bondable surface in the interface between electromechanical connections and electronic circuits. These clad semifinished materials can be further fabricated into pre-stamped strips, in comb form, or single stamped parts <xr id="fig:Examples of clad stamped parts"/> <!--(Fig. 3.18)-->.

Riveted stamped contact parts are manufactured with the use of contact rivets which are transferred over suitable feed mechanisms correctly oriented into holes punched into the carrier <xr id="fig:Examples of riveted stamped parts"/> <!--(Fig. 3.19)-->. Frequently also wire or wire segments resp. are used which are subsequently coined and formed into the desired contact shape (see also chapter [[Attachment of Single Contact Parts#Mechanical Attachment Processes| Mechanical Attachment Processes]]). Both attachment methods have their distinct advantages. Using composite or tri-metal rivets allows limiting the use of precious metal custom tailored to the volume needed for specific switching requirements. For wire staking the precious metal usage is usually higher but the staking can be performed at significantly higher production rates and the additional rivet making step is eliminated.

material <xr id="fig:Examples of pre-mounted stamped component parts"/> <!--(Fig. 3.20?)-->. The assembly of these components as single pieces or stamping progressions is performed in a stamping die by riveting or coining. To increase the current carrying capacity at the joining area an additional welding step can be added. Depending on the requirements the different properties of the two carrier components can be combined. As an example: the high electrical conductivity of a contact carrier blade is joined with the thermal or mechanical spring properties of a second material to form a functional component. For this process both carrier base materials can also be coated with additional layers of other functional materials.

Modern stamping tools usually employ a modular design with integrated dimensional and functional controls <xr id="fig:Progressive die for stamped contact parts"/> <!--(Fig. 3.21)-->.