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Wiki der elektrischen Kontakte

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Willkommen in der neuen Wiki der elektrischen Kontakte

Die Grundlage dieser Wiki ist die 2012er Ausgabe des "DODUCO Datenbuch der elektrischen Kontakte", welches auch in gedruckter Form erhältlich ist.
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Zufälliger Artikel

Applications for Bonding Technologies

Wire Bonding

Wire bonding is the manufacturing process for creating metallurgical bond connections between a thin wire (12.5 – 50 µm for gold fine-wires and 150 – 500 µm for aluminum thick-wires) and a suitably coated circuit carrier through friction welding. In principle, this method consists of pressure welding with the help of ultrasound. The metallurgical bond is mainly caused by frictional heat, created through the relative movement between the two bonding partner materials. To achieve high reliability over longer time and ...

Zufällige Dateien

Typical configurations of toplay contact profiles2.jpg
Typical configurations of toplay contact profiles
Pages: Manufacturing of Semi-Finished Materials,
Herstellung von Halbzeugen

by Doduco Redaktion


Precipitation hardening of CuBe2 (soft) at 325C.jpg
Precipitation hardening of CuBe2 (soft) at 325°C
Pages: Precipitation Hardening Copper Alloys,
Aushärtbare Kupfer-Legierungen

by Doduco Redaktion