...ronic components do not only depend on the contact material. The selection of the most suitable carrier material also plays an important role.
...d materials are considered. These are however not included for the purpose of this data book.
41 KB (6,172 words) - 09:49, 4 January 2023
...ts. Pt and Pd have similar corrosion resistance as gold but for the reason of their catalytical properties, they tend to polymerize adsorbed organic vapo
!Forms of Application
16 KB (2,532 words) - 09:24, 4 January 2023
..._of_Gold_and_Gold_Alloys"/>)<!--(Tab. 2.4)-->. This limits its use in form of thin electroplated or vacuum deposited layers.
...Co and Cu are the more commonly used ones (<xr id="tab:Physical Properties of Gold and Gold-Alloys"/>)<!--(Tab. 2.2)-->.
17 KB (2,736 words) - 08:46, 11 January 2023
[[File:Influence of platinum degussa.jpg|left|thumb|<caption>Einfluss von 1-20 Atom-% verschied
[[File:Influence of palladium.jpg|left|thumb|<caption>Einfluss von 1-22 Atom-% verschiedener Zu
16 KB (2,399 words) - 13:17, 19 December 2022
gegenüber Fremdschichtbildung bieten (<xr id="tab:Mechanical Properties of Gold and Gold-Alloys"/><!--(Table 2.3)-->).
<figtable id="tab:Commonly Used Grades of Gold">
17 KB (2,590 words) - 14:06, 20 December 2022
Cu-ETP ist in <xr id="fig:Strain hardening of Cu-ETP by cold working" /> dargestellt. Die durch Kaltumformung erreichte V
...ter annealing for 3hrs after 25% cold working"/> und <xr id="fig:Softening of Cu-ETP after annealing for 3hrs after 50% cold working"/><!--5.3-->).
41 KB (5,811 words) - 13:14, 9 January 2023