Werkstoffe auf Gold-Basis - Revision history

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Doduco Admin at 13:05, 20 December 2022

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Doduco Admin at 12:36, 9 December 2022

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Teitscheid: German translation

2014-09-22T14:32:31Z

German translation

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Reines Gold ist neben Platin das chemisch beständigste aller Edelmetalle. Gold
in unlegierter Form ist für die Verwendung als Kontaktwerkstoff in elektromechanischen
Bauelementen aufgrund seiner Neigung zum Kleben und Kaltschweißen
auch bei kleinen Kontaktkräften weniger gut geeignet. Außerdem ist Feingold nicht ausreichend mechanisch verschleißfest und widerstandsfähig bei elektrischer
Belastung (<xr id="tab:Contact_and_Switching_Properties_of_Gold_and_Gold_Alloys"/>).
Daher beschränkt sich sein Einsatz meist auf dünne, galvanisch
oder vakuumtechnisch aufgebrachte Schichten.

In der Praxis werden daher üblicherweise schmelztechnisch hergestellte Gold-
Legierungen eingesetzt. Der Schmelzvorgang erfolgt dabei je nach Legierungskomponente
in reduzierender Atmosphäre oder im Vakuum. Die Wahl der
Legierungszusätze hängt wesentlich von der Anwendung der Werkstoffe ab.
Aus der breiten Palette von Gold-Legierungen sind die binären Legierungen mit
Zusätzen < 10 Massen-% an Edelmetallen wie Pt, Pd oder Ag bzw. Unedelmetallen
wie Ni, Co, Cu hervorzuheben (<xr id="tab:Physical_Properties_of_Gold_and_Gold_Alloys"/>). Diese Zusätze erhöhen einerseits
die mechanische Festigkeit und wirken sich vorteilhaft auf das Schaltverhalten
aus, verringern andererseits je nach Legierungspartner mehr oder weniger
stark die elektrische Leitfähigkeit und die Korrosionsbeständigkeit (<xr id="fig:Influence_of_1_10_atomic_of_different"/>).

Vor allem unter dem Aspekt der Goldeinsparung sind die ternären Legierungen
mit Goldgehalten von ca. 70 Massen-% und Zusätzen von Ag und Cu bzw. Ag
und Ni, z.B. AuAg25Cu5 oder AuAg20Cu10 zu sehen, die für viele Anwendungsfälle
bei guten mechanischen Eigenschaften ausreichende Beständigkeit
gegenüber Fremdschichtbildung bieten (<xr id="tab:Mechanical Properties of Gold and Gold-Alloys"/>). Weitere ternäre Legierungen,
die aus dem AuAg-System hervorgehen, sind die Werkstoffe AuAg26Ni3 und
AuAg25Pt6. Diese Legierungen ähneln in ihren mechanischen Eigenschaften
den AuAgCu-Legierungen, sind aber bei höheren Temperaturen deutlich
oxidationsbeständiger.

<figtable id="tab:Commonly Used Grades of Gold">
<caption>'''Überblick über die gebräuchlichsten Gold-Qualitäten'''</caption>
<table class="twocolortable">

<tr><th>Bezeichnung</th><th>Zusammensetzung Au(Mindestanteil)</th><th>Beimengungen in ppm/p></th><th>Hinweise für die Verwendung</th></tr><tr><td>Spektralreines GoldGold</td><td>99.999</td><td>Cu < 3Ag < 3Ca < 1Mg <1Fe < 1</td><td>Drähte, Bleche, Legierungszusätze für
Halbleiter, elektronische Bauelemente</td></tr><tr><td>Hochreines Gold</td><td>99.995</td><td>Cu < 10Ag < 15Ca < 20Mg < 10Fe < 3Si < 10Pb < 20</td><td>Granalien für hochreine Legierungen, Bleche, Bänder, Rohre, Profile</td></tr><tr><td>Barren-Gold</td><td>99.95</td><td>Cu < 100Ag < 150Ca < 50Mg < 50Fe < 30Si < 10</td><td>Legierungen, übliche Qualität</td></tr></table>
</figtable>

<div class="multiple-images">
<figtable id="tab:Physical_Properties_of_Gold_and_Gold_Alloys">
[[File:Physical Properties of Gold and Gold-Alloys.jpg|left|thumb|<caption>Physikalische Eigenschaften von Gold und Goldlegierungen</caption>]]
</figtable>
<figure id="fig:Influence_of_1_10_atomic_of_different">
[[File:Influence of 1-10 atomic of different.jpg|left|thumb|<caption>Einfluss von 1-10 Atom-% verschiedener Zusatzmetalle auf den spez. elektrischen Widerstand p von Gold (nach Linde)</caption>]]
</figure>
</div>
<div class="clear"></div>

<figtable id="tab:Mechanical Properties of Gold and Gold-Alloys">
<caption>'''Festigkeitseigenschaften von Gold und Goldlegierungen'''</caption>
{| class="twocolortable" style="text-align: left; font-size: 12px"
|-
!Werkstoff
!Festigkeitszustand
!Zugfestigkeit Rm [MPa] min.
!Dehnung A10 [%] min.
!Vickershärte HV
|-
|Au
|R 140 R 170 R 200 R 240
|140 170 200 240
|30 3 2 1
|20 50 60 70
|-
|AuAg20
|R 190 R 250 R 320 R 390
|190 250 320 390
|25 2 1 1
|38 70 95 115
|-
|AuAg30
|R 220 R 260 R 320 R 380
|220 260 320 380
|25 3 1 1
|45 75 95 110
|-
|AuAg25Cu5
|R 400 R 470 R 570 R 700
|400 470 570 700
|25 4 2 2
|90 120 160 185
|-
|AuAg20Cu10
|R 480 R 560 R 720 R 820
|480 560 720 820
|20 3 1 1
|125 145 190 230
|-
|AuAg26Ni3
|R 350 R 420 R 500 R 570
|350 420 500 570
|20 2 1 1
|85 110 135 155
|-
|AuAg25Pt6
|R 280 R 330 R 410 R 480
|280 330 410 480
|18 2 1 1
|60 90 105 125
|-
|AuCo5
|R 340 R 390 R 450 R 530
|340 390 450 530
|10 2 1 1
|95 105 120 150
|-
|AuCo5 prec.hardened
|heterogeneous
|360
|3
|110-130
|-
|AuNi5
|R 380 R 450 R 560 R 640
|380 450 560 640
|25 3 2 1
|115 135 160 190
|-
|AuPt10
|R 260 R 310 R 370 R 410
|260 310 370 410
|20 2 1 1
|80 90 100 105
|-
|AuCu14Pt9Ag4
|R 620 R 700 R 850 R 950 prec.hardened
|620 700 850 950 900
|20 3 2 1 3
|190 225 260 270 280
|}
</figtable>

Other ternary alloys based on the AuAg system are AuAg26Ni3 and AuAg25Pt6. These alloys are mechanically similar to the AuAgCu alloys but have significantly higher oxidation resistance at elevated temperatures <xr id="tab:Contact_and_Switching_Properties_of_Gold_and_Gold_Alloys"/>.

<figtable id="tab:Contact_and_Switching_Properties_of_Gold_and_Gold_Alloys">
<caption>'''Contact and Switching Properties of Gold and Gold Alloys'''</caption>
<table class="twocolortable">
<tr><th>Material</th><th>Properties<th colspan="2"></th></tr><tr><td>Au</td><td>Highest corrosion resistance, lowhardness</td><td>High electr. conductivity,strong tendency to cold welding</td></tr><tr><td>AuAg8</td><td>High corrosion resistance, low thermoe.m.f.</td><td>Low contact resistance</td></tr><tr><td>AuPt10AuPd5</td><td>Very high corrosion resistance</td><td>High hardness</td></tr><tr><td>AuAg10 - 30</td><td>Mostly corrosion resistant</td><td>Higher hardness</td></tr><tr><td>AuNi5AuCo5</td><td>High corrosion resistance, lowtendency to material transfer</td><td>High hardness</td></tr><tr><td>AuAg25Pt6</td><td>High corrosion resistance, low contact resistance</td><td>High hardness</td></tr><tr><td>AuAg26Ni3AuAg25Cu5AuAg20Cu10</td><td>Limited corrosion resistance</td><td>High hardness</td></tr><tr><td>AuPd40AuPd35Ag10AuCu14Pt9Ag4</td><td>High corrosion resistance</td><td>High hardness and mechanicalwear resistance</td></tr></table>
</figtable>

Caused by higher gold prices over the past years the development of alloys with further reduced gold content had a high priority. The starting point has been the AuPd system which has continuous solubility of the two components. Besides the binary alloy of AuPd40 and the ternary one AuPd35Ag9 other multiple component alloys were developed. These alloys typically have < 50 wt% Au and often can be solution hardened in order to obtain even higher hardness and tensile strength. They are mostly used in sliding contact applications.

Gold alloys are used in the form of welded wire or profile (also called weldtapes), segments, contact rivets, and stampings produced from clad strip
materials. The selection of the bonding process is based on the cost for the joining process, and most importantly on the economical aspect of using the least possible amount of the expensive precious metal component.

Besides being used as switching contacts in relays and pushbuttons, gold alloys are also applied in the design of connectors as well as sliding contacts for potentiometers, sensors, slip rings, and brushes in miniature DC motors <xr id="tab:Application Examples and Forms of Gold and Gold Alloys"/>.

<figtable id="tab:Application Examples and Forms of Gold and Gold Alloys">
<caption>'''Application Examples and Forms of Gold and Gold Alloys'''</caption>

<table class="twocolortable">
<tr><th>Material</th><th>Application Examples</th><th>Form of Application</th></tr><tr><td>Pure Gold(electroplated)</td><td>Corrosion protection layer for contact parts, stationary contacts, bonding surfaces</td><td>Electroplated coatings, bond surface layers</td></tr><tr><td>Hard Gold(sputtered)</td><td>Contact parts for connectors and switches, sliding contact tracks, bonding surfaces</td><td>Electroplated coatings on contact rivets and stamped parts</td></tr><tr><td>Hard Gold(sputtered)</td><td>Contacts in switches and relays for low loads, electronic signal relays</td><td>Contact surface layer on miniatureprofiles (weld tapes)</td></tr><tr><td>AuAg8</td><td>Dry circuit switching contacts, electronicsignal relays</td><td>Contact rivets, welded contactparts</td></tr><tr><td>AuAg20</td><td>Switching contacts for low loads, electronicsignal relays</td><td>Contact rivets, welded contactparts</td></tr><tr><td>AuAg25Cu5AuAg25Cu10AuAg26Ni3</td><td>Contact parts for connectors, switches and relays</td><td>Claddings on Cu alloys, contact rivets, contact layer on micro profiles (weld tapes)</td></tr><tr><td>AuNi5AuCo5 (heterogen)</td><td>Contacts in switches and relays for low and medium loads, material transfer resistant contacts</td><td>Contact rivets, welded contact parts, contact layer on miniature profiles (weld tapes)</td></tr><tr><td>AuPt10AuAg25Pt6</td><td>Contacts for highest chemical corrosion resistance in switches and relays</td><td>Contact rivets, contact layer on micro profiles (weld tapes)</td></tr><tr><td>AuCu14Pt9Ag4</td><td>Sliding contacts for measurement data transfer</td><td>Wire-formed parts</td></tr></table>
</figtable>

<xr id="fig:Phase diagram of goldplatinum"/> Fig. 2.3: Phase diagram of goldplatinum

<xr id="fig:Phase diagram of gold-silver"/> Fig. 2.4: Phase diagram of gold-silver

<xr id="fig:Phase diagram of gold-copper"/> Fig. 2.5: Phase diagram of gold-copper

<xr id="fig:Phase diagram of gold-nickel"/> Fig. 2.6: Phase diagram of gold-nickel

<xr id="fig:Phase diagram of gold-cobalt"/> Fig. 2.7: Phase diagram of gold-cobalt

<xr id="fig:Strain hardening of Au by cold working"/> Fig. 2.8: Strain hardening of Au by cold working

<xr id="fig:Softening of Au after annealing for 0.5 hrs"/> Fig. 2.9: Softening of Au after annealing for 0.5 hrs after 80% cold working

<xr id="fig:Strain hardening of AuPt10 by cold working"/> Fig. 2.10: Strain hardening of AuPt10 by cold working

<xr id="fig:Strain hardening of AuAg20 by cold working"/> Fig. 2.11: Strain hardening of AuAg20 by cold working

<xr id="fig:Strain hardening of AuAg30 by cold working"/> Fig. 2.12: Strain hardening of AuAg30 by cold working

<xr id="fig:Strain hardening of AuNi5 by cold working"/> Fig. 2.13: Strain hardening of AuNi5 by cold working

<xr id="fig:Softening of AuNi5 after annealing for 0.5 hrs"/> Fig. 2.14: Softening of AuNi5 after annealing for 0.5 hrs after 80% cold working

<xr id="fig:Strain hardening of AuCo5 by cold working"/> Fig. 2.15: Strain hardening of AuCo5 by cold working

<xr id="fig:Precipitation hardening of AuCo5 at"/> Fig. 2.16: Precipitation hardening of AuCo5 at 400°C hardening temperature

<xr id="fig:Strain hardening of AuAg25Pt6 by cold working"/> Fig. 2.17: Strain hardening of AuAg25Pt6 by cold working

<xr id="fig:Strain hardening of AuAg26Ni3 by cold working"/> Fig. 2.18: Strain hardening of AuAg26Ni3 by cold working

<xr id="fig:Softening of AuAg26Ni3 after annealing for 0.5-hrs"/> Fig. 2.19: Softening of AuAg26Ni3 after annealing for 0.5 hrs after 80% cold working

<xr id="fig:Strain hardening of AuAg25Cu5 by cold working"/> Fig. 2.20: Strain hardening of AuAg25Cu5 by cold working

<xr id="fig:Strain hardening of AuAg20Cu10 by cold working"/> Fig. 2.21: Strain hardening of AuAg20Cu10 by cold working

<xr id="fig:Softening of AuAg20Cu10 after annealing for 0.5 hrs"/> Fig. 2.22: Softening of AuAg20Cu10 after annealing for 0.5 hrs after 80% cold working

<xr id="fig:Strain hardening of AuCu14Pt9Ag4 by cold working"/> Fig. 2.23: Strain hardening of AuCu14Pt9Ag4 by cold working

<xr id="fig:Precipitation hardening of AuCu14Pt9Ag4"/> Fig. 2.24: Precipitation hardening of AuCu14Pt9Ag4 at different hardening temperatures after 50% cold working

<div class="multiple-images">
<figure id="fig:Phase diagram of goldplatinum">
[[File:Phase diagram of goldplatinum.jpg|left|thumb|<caption>Phase diagram of goldplatinum</caption>]]
</figure>

<figure id="fig:Phase diagram of gold-silver">
[[File:Phase diagram of gold-silver.jpg|left|thumb|<caption>Phase diagram of gold-silver</caption>]]
</figure>

<figure id="fig:Phase diagram of gold-copper">
[[File:Phase diagram of gold-copper.jpg|left|thumb|<caption>Phase diagram of gold-copper</caption>]]
</figure>

<figure id="fig:Phase diagram of gold-nickel">
[[File:Phase diagram of gold-nickel.jpg|left|thumb|<caption>Phase diagram of gold-nickel</caption>]]
</figure>

<figure id="fig:Phase diagram of gold-cobalt">
[[File:Phase diagram of gold-cobalt.jpg|left|thumb|<caption>Phase diagram of gold-cobalt</caption>]]
</figure>

<figure id="fig:Strain hardening of Au by cold working">
[[File:Strain hardening of Au by cold working.jpg|left|thumb|<caption>Strain hardening of Au by cold working</caption>]]
</figure>

<figure id="fig:Softening of Au after annealing for 0.5 hrs">
[[File:Softening of Au after annealing for 0.5 hrs.jpg|left|thumb|<caption>Softening of Au after annealing for 0.5 hrs after 80% cold working</caption>]]
</figure>

<figure id="fig:Strain hardening of AuPt10 by cold working">
[[File:Strain hardening of AuPt10 by cold working.jpg|left|thumb|<caption>Strain hardening of AuPt10 by cold working</caption>]]
</figure>

<figure id="fig:Strain hardening of AuAg20 by cold working">
[[File:Strain hardening of AuAg20 by cold working.jpg|left|thumb|<caption>Strain hardening of AuAg20 by cold working</caption>]]
</figure>

<figure id="fig:Strain hardening of AuAg30 by cold working">
[[File:Strain hardening of AuAg30 by cold working.jpg|left|thumb|<caption>Strain hardening of AuAg30 by cold working</caption>]]
</figure>

<figure id="fig:Strain hardening of AuNi5 by cold working">
[[File:Strain hardening of AuNi5 by cold working.jpg|left|thumb|<caption>Strain hardening of AuNi5 by cold working</caption>]]
</figure>

<figure id="fig:Softening of AuNi5 after annealing for 0.5 hrs">
[[File:Softening of AuNi5 after annealing for 0.5 hrs.jpg|left|thumb|<caption>Softening of AuNi5 after annealing for 0.5 hrs after 80% cold working</caption>]]
</figure>

<figure id="fig:Strain hardening of AuCo5 by cold working">
[[File:Strain hardening of AuCo5 by cold working.jpg|left|thumb|<caption>Strain hardening of AuCo5 by cold working</caption>]]
</figure>

<figure id="fig:Precipitation hardening of AuCo5 at">
[[File:Precipitation hardening of AuCo5 at.jpg|left|thumb|<caption>Precipitation hardening of AuCo5 at 400°C hardening temperature</caption>]]
</figure>

<figure id="fig:Strain hardening of AuAg25Pt6 by cold working">
[[File:Strain hardening of AuAg25Pt6 by cold working.jpg|left|thumb|<caption>Strain hardening of AuAg25Pt6 by cold working</caption>]]
</figure>

<figure id="fig:Strain hardening of AuAg26Ni3 by cold working">
[[File:Strain hardening of AuAg26Ni3 by cold working.jpg|left|thumb|<caption>Strain hardening of AuAg26Ni3 by cold working</caption>]]
</figure>

<figure id="fig:Softening of AuAg26Ni3 after annealing for 0.5-hrs">
[[File:Softening of AuAg26Ni3 after annealing for 0.5-hrs.jpg|left|thumb|<caption>Softening of AuAg26Ni3 after annealing for 0.5 hrs after 80% cold working</caption>]]
</figure>

<figure id="fig:Strain hardening of AuAg25Cu5 by cold working">
[[File:Strain hardening of AuAg25Cu5 by cold working.jpg|left|thumb|<caption>Strain hardening of AuAg25Cu5 by cold working</caption>]]
</figure>

<figure id="fig:Strain hardening of AuAg20Cu10 by cold working">
[[File:Strain hardening of AuAg20Cu10 by cold working.jpg|left|thumb|<caption>Strain hardening of AuAg20Cu10 by cold working</caption>]]
</figure>

<figure id="fig:Softening of AuAg20Cu10 after annealing for 0.5 hrs">
[[File:Softening of AuAg20Cu10 after annealing for 0.5 hrs.jpg|left|thumb|<caption>Softening of AuAg20Cu10 after annealing for 0.5 hrs after 80% cold working</caption>]]
</figure>

<figure id="fig:Strain hardening of AuCu14Pt9Ag4 by cold working">
[[File:Strain hardening of AuCu14Pt9Ag4 by cold working.jpg|left|thumb|<caption>Strain hardening of AuCu14Pt9Ag4 by cold working</caption>]]
</figure>

<figure id="fig:Precipitation hardening of AuCu14Pt9Ag4">
[[File:Precipitation hardening of AuCu14Pt9Ag4.jpg|left|thumb|<caption>Precipitation hardening of AuCu14Pt9Ag4 at different hardening temperatures after 50% cold working</caption>]]
</figure>
</div>
<div class="clear"></div>

==Referenzen==
[[Kontaktwerkstoffe_für_die_Elektrotechnik#Referenzen|Referenzen]]

[[en:Gold_Based_Materials]]

← Older revision		Revision as of 12:36, 9 December 2022
Line 168:		Line 168:
	</figtable>		</figtable>

−
−
−	~~<xr id="fig:Phase diagram of goldplatinum"/> Fig. 2.3: Zustandsdiagramm von Gold-Platin~~
−
−
−	~~<xr id="fig:Phase diagram of gold-silver"/> Fig. 2.4: Zustandsdiagramm von Gold-Silber~~
−
−
−	~~<xr id="fig:Phase diagram of gold-copper"/> Fig. 2.5: Zustandsdiagramm von Gold-Kupfer~~
−
−
−	~~<xr id="fig:Phase diagram of gold-nickel"/> Fig. 2.6: Zustandsdiagramm von Gold-Nickel~~
−
−
−	~~<xr id="fig:Phase diagram of gold-cobalt"/> Fig. 2.7: Zustandsdiagramm von Gold-Kobalt~~
−
−
−	~~<xr id="fig:Strain hardening of Au by cold working"/> Fig. 2.8: Verfestigungsverhalten von Au durch Kaltumformung~~
−
−
−	~~<xr id="fig:Softening of Au after annealing for 0.5 hrs"/> Fig. 2.9: Erweichungsverhalten von Au nach 0,5h Glühdauer und einer Kaltumformung von 80%~~
−
−
−	~~<xr id="fig:Strain hardening of AuPt10 by cold working"/> Fig. 2.10: Verfestigungsverhalten von AuPt10 durch Kaltumformung~~
−
−
−	~~<xr id="fig:Strain hardening of AuAg20 by cold working"/> Fig. 2.11: Verfestigungsverhalten von AuAg20 durch Kaltumformung~~
−
−
−	~~<xr id="fig:Strain hardening of AuAg30 by cold working"/> Fig. 2.12: Verfestigungsverhalten von AuAg30 durch Kaltumformung~~
−
−
−	~~<xr id="fig:Strain hardening of AuNi5 by cold working"/> Fig. 2.13: Verfestigungsverhalten von AuNi5 durch Kaltumformung~~
−
−
−	~~<xr id="fig:Softening of AuNi5 after annealing for 0.5 hrs"/> Fig. 2.14: Erweichungsverhalten von AuNi5 nach 0,5h Glühdauer und einer Kaltumformung von 80%~~
−
−
−	~~<xr id="fig:Strain hardening of AuCo5 by cold working"/> Fig. 2.15: Verfestigungsverhalten von AuCo5 durch Kaltumformung~~
−
−
−	~~<xr id="fig:Precipitation hardening of AuCo5 at"/> Fig. 2.16: Aushärtung von AuCo5 bei 400°C Aushärtungstemperatur~~
−
−
−	~~<xr id="fig:Strain hardening of AuAg25Pt6 by cold working"/> Fig. 2.17: Verfestigungsverhalten von AuAg25Pt6 durch Kaltumformung~~
−
−
−	~~<xr id="fig:Strain hardening of AuAg26Ni3 by cold working"/> Fig. 2.18: Verfestigungsverhalten von AuAg26Ni3 durch Kaltumformung~~
−
−
−	~~<xr id="fig:Softening of AuAg26Ni3 after annealing for 0.5-hrs"/> Fig. 2.19: Erweichungsverhalten von AuAg26Ni3 nach 0,5h Glühdauer und einer Kaltumformung von 80%~~
−
−
−	~~<xr id="fig:Strain hardening of AuAg25Cu5 by cold working"/> Fig. 2.20: Verfestigungsverhalten von AuAg25Cu5 durch Kaltumformung~~
−
−
−	~~<xr id="fig:Strain hardening of AuAg20Cu10 by cold working"/> Fig. 2.21: Verfestigungsverhalten von AuAg20Cu10 durch Kaltumformung~~
−
−
−	~~<xr id="fig:Softening of AuAg20Cu10 after annealing for 0.5 hrs"/> Fig. 2.22: Erweichungsverhalten von AuAg20Cu10 nach 0,5h Glühdauer und einer Kaltumformung von 80%~~
−
−
−	~~<xr id="fig:Strain hardening of AuCu14Pt9Ag4 by cold working"/> Fig. 2.23: Verfestigungsverhalten von AuCu14Pt9Ag4 durch Kaltumformung~~
−
−
−	~~<xr id="fig:Precipitation hardening of AuCu14Pt9Ag4"/> Fig. 2.24: Aushärtung von AuCu14Pt9Ag4 nach 50% Kaltumformung bei verschiedenen Anlasstemperaturen~~

@@ Line 101: / Line 101: @@
 |95<br />105<br />120<br />150
 |-
-|AuCo5 prec.hardened
+|AuCo5 vergütet
-|heterogeneous
+|heterogen
 |360
 |3
@@ Line 120: / Line 120: @@
 |-
 |AuCu14Pt9Ag4
-|R 620<br />R 700<br />R 850<br />R 950<br />prec.hardened
+|R 620<br />R 700<br />R 850<br />R 950<br />vergütet
 |620<br />700<br />850<br />950<br />900
 |20<br />3<br />2<br />1<br />3
@@ Line 136: / Line 136: @@
 <caption>'''Kontakt- und Schalteigenschaften von Gold und Goldlegierungen'''</caption>
 <table class="twocolortable">
-<tr><th><p class="s11">Material</p></th><th><p class="s12">Properties<th colspan="2"></p></th></tr><tr><td><p class="s11">Au</p></td><td><p class="s12">Highest corrosion resistance, low</p><p class="s12">hardness</p></td><td><p class="s12">High electr. conductivity,</p><p class="s12">strong tendency to cold welding</p></td></tr><tr><td><p class="s11">AuAg8</p></td><td><p class="s12">High corrosion resistance, low thermo</p><p class="s12">e.m.f.</p></td><td><p class="s12">Low contact resistance</p></td></tr><tr><td><p class="s11">AuPt10</p><p class="s11">AuPd5</p></td><td><p class="s12">Very high corrosion resistance</p></td><td><p class="s12">High hardness</p></td></tr><tr><td><p class="s11">AuAg10 - 30</p></td><td><p class="s12">Mostly corrosion resistant</p></td><td><p class="s12">Higher hardness</p></td></tr><tr><td><p class="s11">AuNi5</p><p class="s11">AuCo5</p></td><td><p class="s12">High corrosion resistance, low</p><p class="s12">tendency to material transfer</p></td><td><p class="s12">High hardness</p></td></tr><tr><td><p class="s11">AuAg25Pt6</p></td><td><p class="s12">High corrosion resistance, low contact resistance</p></td><td><p class="s12">High hardness</p></td></tr><tr><td><p class="s11">AuAg26Ni3</p><p class="s11">AuAg25Cu5</p><p class="s11">AuAg20Cu10</p></td><td><p class="s12">Limited corrosion resistance</p></td><td><p class="s12">High hardness</p></td></tr><tr><td><p class="s11">AuPd40</p><p class="s11">AuPd35Ag10</p><p class="s11">AuCu14Pt9Ag4</p></td><td><p class="s12">High corrosion resistance</p></td><td><p class="s12">High hardness and mechanical</p><p class="s12">wear resistance</p></td></tr></table>
+<tr><th><p class="s11">Werkstoff</p></th><th><p class="s12">Eigenschaften<th colspan="2"></p></th></tr><tr><td><p class="s11">Au</p></td><td><p class="s12">Höchste Korrosionsbeständigkeit,</p><p class="s12">geringe Härte</p></td><td><p class="s12">hohe elektrische Leitfähigkeit,</p><p class="s12">starke Neigung zum Kaltschweißen</p></td></tr><tr><td><p class="s11">AuAg8</p></td><td><p class="s12">Hohe Korrosionsbeständigkeit,</p><p class="s12">thermokraftarm</p></td><td><p class="s12">niedriger Kontaktwiderstand</p></td></tr><tr><td><p class="s11">AuPt10</p><p class="s11">AuPd5</p></td><td><p class="s12">Sehr hohe Korrosionsbeständigkeit</p></td><td><p class="s12">hohe Härte</p></td></tr><tr><td><p class="s11">AuAg10 - 30</p></td><td><p class="s12">Weitgehend korrosionsbeständig</p></td><td><p class="s12">höhere Härte</p></td></tr><tr><td><p class="s11">AuNi5</p><p class="s11">AuCo5</p></td><td><p class="s12">Hohe Korrosionsbeständigkeit,</p><p class="s12">geringe Neigung zur Materialwanderung</p></td><td><p class="s12">hohe Härte</p></td></tr><tr><td><p class="s11">AuAg25Pt6</p></td><td><p class="s12">Hohe Korrosionsbeständigkeit, niedriger Kontaktwiderstand</p></td><td><p class="s12">hohe Härte</p></td></tr><tr><td><p class="s11">AuAg26Ni3</p><p class="s11">AuAg25Cu5</p><p class="s11">AuAg20Cu10</p></td><td><p class="s12">Bedingt korrosionsbeständig</p></td><td><p class="s12">hohe Härte</p></td></tr><tr><td><p class="s11">AuPd40</p><p class="s11">AuPd35Ag10</p><p class="s11">AuCu14Pt9Ag4</p></td><td><p class="s12">Hohe Korrosionsbeständigkeit</p></td><td><p class="s12">hohe Verschleißfestigkeit</p></td></tr></table>
 </figtable>
@@ Line 163: / Line 163: @@
 <table class="twocolortable">
-<tr><th><p class="s11">Material</p></th><th><p class="s12">Application Examples</p></th><th><p class="s12">Form of Application</p></th></tr><tr><td><p class="s11">Pure Gold</p><p class="s11">(electroplated)</p></td><td><p class="s12">Corrosion protection layer for contact parts, stationary contacts, bonding surfaces</p></td><td><p class="s12">Electroplated coatings, bond surface layers</p></td></tr><tr><td><p class="s11">Hard Gold</p><p class="s11">(sputtered)</p></td><td><p class="s12">Contact parts for connectors and switches, sliding contact tracks, bonding surfaces</p></td><td><p class="s12">Electroplated coatings on contact rivets and stamped parts</p></td></tr><tr><td><p class="s11">Hard Gold</p><p class="s11">(sputtered)</p></td><td><p class="s12">Contacts in switches and relays for low loads, electronic signal relays</p></td><td><p class="s12">Contact surface layer on miniature</p><p class="s12">profiles (weld tapes)</p></td></tr><tr><td><p class="s11">AuAg8</p></td><td><p class="s12">Dry circuit switching contacts, electronic</p><p class="s12">signal relays</p></td><td><p class="s12">Contact rivets, welded contact</p><p class="s12">parts</p></td></tr><tr><td><p class="s11">AuAg20</p></td><td><p class="s12">Switching contacts for low loads, electronic</p><p class="s12">signal relays</p></td><td><p class="s12">Contact rivets, welded contact</p><p class="s12">parts</p></td></tr><tr><td><p class="s11">AuAg25Cu5</p><p class="s11">AuAg25Cu10</p><p class="s11">AuAg26Ni3</p></td><td><p class="s12">Contact parts for connectors, switches and relays</p></td><td><p class="s12">Claddings on Cu alloys, contact rivets, contact layer on micro profiles (weld tapes)</p></td></tr><tr><td><p class="s11">AuNi5</p><p class="s11">AuCo5 (heterogen)</p></td><td><p class="s12">Contacts in switches and relays for low and medium loads, material transfer resistant contacts</p></td><td><p class="s12">Contact rivets, welded contact parts, contact layer on miniature profiles (weld tapes)</p></td></tr><tr><td><p class="s11">AuPt10</p><p class="s11">AuAg25Pt6</p></td><td><p class="s12">Contacts for highest chemical corrosion resistance in switches and relays</p></td><td><p class="s12">Contact rivets, contact layer on micro profiles (weld tapes)</p></td></tr><tr><td><p class="s11">AuCu14Pt9Ag4</p></td><td><p class="s12">Sliding contacts for measurement data transfer</p></td><td><p class="s12">Wire-formed parts</p></td></tr></table>
+<tr><th><p class="s11">Werkstoff</p></th><th><p class="s12">Anwendungsbeispiele</p></th><th><p class="s12">Anwendungsformen</p></th></tr><tr><td><p class="s11">Feingold</p><p class="s11">(galvanisch)</p></td><td><p class="s12">Korrosionsschutz für Kontaktteile, ruhende Kontakte, Bondverbindungen</p></td><td><p class="s12">Galvanische Überzüge, Bondschichten</p></td></tr><tr><td><p class="s11">Hartgold</p><p class="s11">(galvanisch)</p></td><td><p class="s12">Kontaktteile für Steckverbinder und Schalter, Gleitkontaktbahnen, Bondverbindungen</p></td><td><p class="s12">Galvanische Überzüge auf Kontaktnieten und Stanzteilen</p></td></tr><tr><td><p class="s11">Hartgold</p><p class="s11">(gesputtert)</p></td><td><p class="s12">Kontaktstellen in Schaltern und Relais für geringe Lasten, Signalrelais</p></td><td><p class="s12">Kontaktschicht auf Miniprofilen</p></td></tr><tr><td><p class="s11">AuAg8</p></td><td><p class="s12">Schaltende Kontakte in trockenen Stromkreisen, Signalrelais</p></td><td><p class="s12">Kontaktniete, geschweißte Kontaktteile</p></td></tr><tr><td><p class="s11">AuAg20</p></td><td><p class="s12">Schaltende Kontakte für geringe Lasten,</p><p class="s12">Signalrelais</p></td><td><p class="s12">Kontaktniete, geschweißte Kontaktteile</p></td></tr><tr><td><p class="s11">AuAg25Cu5</p><p class="s11">AuAg25Cu10</p><p class="s11">AuAg26Ni3</p></td><td><p class="s12">Kontaktteile für Steckverbinder, Schalter und Relais</p></td><td><p class="s12">Plattierungen auf Cu-Legierungen,
 </figtable>

@@ Line 173: / Line 173: @@
 <div class="multiple-images">
 <figure id="fig:Influence_of_1_10_atomic_of_different">
 [[File:Influence of 1-10 atomic of different.jpg|left|thumb|<caption>Einfluss von 1-10 Atom-% verschiedener Zusatzmetalle auf den spez. elektrischen Widerstand p von Gold (nach Linde)</caption>]]

@@ Line 13: / Line 13: @@
 Aus der breiten Palette von Gold-Legierungen sind die binären Legierungen mit
 Zusätzen < 10 Massen-% an Edelmetallen wie Pt, Pd oder Ag bzw. Unedelmetallen
-wie Ni, Co, Cu hervorzuheben (<xr id="tab:Physical_Properties_of_Gold_and_Gold_Alloys"/><!--(Tab. 2.2)-->). Diese Zusätze erhöhen einerseits
+wie Ni, Co, Cu hervorzuheben (<xr id="tab:Physikalische Eigenschaften von Gold und Gold-Legierungen"/><!--(Tab. 2.2)-->). Diese Zusätze erhöhen einerseits
 die mechanische Festigkeit und wirken sich vorteilhaft auf das Schaltverhalten
 aus, verringern andererseits je nach Legierungspartner mehr oder weniger
@@ Line 30: / Line 30: @@
 <tr><th><p class="s11">Bezeichnung</p></th><th><p class="s11">Zusammensetzung Au</p><p class="s11">(Mindestanteil)</p></th><th><p class="s11">Beimengungen in ppm/p></th><th><p class="s12">Hinweise für die Verwendung</p></th></tr><tr><td><p class="s11">Spektralreines Gold</p><p class="s11">Gold</p></td><td><p class="s11">99.999</p></td><td><p class="s11">Cu &lt; 3</p><p class="s11">Ag &lt; 3</p><p class="s11">Ca &lt; 1</p><p class="s11">Mg &lt;1</p><p class="s11">Fe &lt; 1</p></td><td><p class="s12">Drähte, Bleche, Legierungszusätze für
 Halbleiter, elektronische Bauelemente</p></td></tr><tr><td><p class="s11">Hochreines Gold</p></td><td><p class="s11">99.995</p></td><td><p class="s11">Cu &lt; 10</p><p class="s11">Ag &lt; 15</p><p class="s11">Ca &lt; 20</p><p class="s11">Mg &lt; 10</p><p class="s11">Fe &lt; 3</p><p class="s11">Si &lt; 10</p><p class="s11">Pb &lt; 20</p></td><td><p class="s12">Granalien für hochreine Legierungen, Bleche, Bänder, Rohre, Profile</p></td></tr><tr><td><p class="s11">Barren-Gold</p></td><td><p class="s11">99.95</p></td><td><p class="s11">Cu &lt; 100</p><p class="s11">Ag &lt; 150</p><p class="s11">Ca &lt; 50</p><p class="s11">Mg &lt; 50</p><p class="s11">Fe &lt; 30</p><p class="s11">Si &lt; 10</p></td><td><p class="s12">Legierungen, übliche Qualität</p></td></tr></table>
 </figtable>

@@ Line 22: / Line 22: @@
 und Ni, z.B. AuAg25Cu5 oder AuAg20Cu10 zu sehen, die für viele Anwendungsfälle
 bei guten mechanischen Eigenschaften ausreichende Beständigkeit
-gegenüber Fremdschichtbildung bieten (<xr id="tab:Mechanical Properties of Gold and Gold-Alloys"/><!--(Table 2.3)-->). Weitere ternäre Legierungen,
+gegenüber Fremdschichtbildung bieten (<xr id="tab:Mechanical Properties of Gold and Gold-Alloys"/><!--(Table 2.3)-->).
 <figtable id="tab:Commonly Used Grades of Gold">
@@ Line 131: / Line 127: @@
 </figtable>
-Other ternary alloys based on the AuAg system are AuAg26Ni3 and AuAg25Pt6. These alloys are mechanically similar to the AuAgCu alloys but have significantly higher oxidation resistance at elevated temperatures <xr id="tab:Contact_and_Switching_Properties_of_Gold_and_Gold_Alloys"/><!--(Table 2.4)-->.
+Weitere ternäre Legierungen,
 <figtable id="tab:Contact_and_Switching_Properties_of_Gold_and_Gold_Alloys">
-<caption>'''<!--Table 2.4:-->Contact and Switching Properties of Gold and Gold Alloys'''</caption>
+<caption>'''Kontakt- und Schalteigenschaften von Gold und Goldlegierungen'''</caption>
 <table class="twocolortable">
 <tr><th><p class="s11">Material</p></th><th><p class="s12">Properties<th colspan="2"></p></th></tr><tr><td><p class="s11">Au</p></td><td><p class="s12">Highest corrosion resistance, low</p><p class="s12">hardness</p></td><td><p class="s12">High electr. conductivity,</p><p class="s12">strong tendency to cold welding</p></td></tr><tr><td><p class="s11">AuAg8</p></td><td><p class="s12">High corrosion resistance, low thermo</p><p class="s12">e.m.f.</p></td><td><p class="s12">Low contact resistance</p></td></tr><tr><td><p class="s11">AuPt10</p><p class="s11">AuPd5</p></td><td><p class="s12">Very high corrosion resistance</p></td><td><p class="s12">High hardness</p></td></tr><tr><td><p class="s11">AuAg10 - 30</p></td><td><p class="s12">Mostly corrosion resistant</p></td><td><p class="s12">Higher hardness</p></td></tr><tr><td><p class="s11">AuNi5</p><p class="s11">AuCo5</p></td><td><p class="s12">High corrosion resistance, low</p><p class="s12">tendency to material transfer</p></td><td><p class="s12">High hardness</p></td></tr><tr><td><p class="s11">AuAg25Pt6</p></td><td><p class="s12">High corrosion resistance, low contact resistance</p></td><td><p class="s12">High hardness</p></td></tr><tr><td><p class="s11">AuAg26Ni3</p><p class="s11">AuAg25Cu5</p><p class="s11">AuAg20Cu10</p></td><td><p class="s12">Limited corrosion resistance</p></td><td><p class="s12">High hardness</p></td></tr><tr><td><p class="s11">AuPd40</p><p class="s11">AuPd35Ag10</p><p class="s11">AuCu14Pt9Ag4</p></td><td><p class="s12">High corrosion resistance</p></td><td><p class="s12">High hardness and mechanical</p><p class="s12">wear resistance</p></td></tr></table>
 </figtable>
-Caused by higher gold prices over the past years the development of alloys with further reduced gold content had a high priority. The starting point has been the AuPd system which has continuous solubility of the two components. Besides the binary alloy of AuPd40 and the ternary one AuPd35Ag9 other multiple component alloys were developed. These alloys typically have < 50 wt% Au and often can be solution hardened in order to obtain even higher hardness and tensile strength. They are mostly used in sliding contact applications.
+Aufgrund des hohen Goldpreises tendiert seit Jahren die Entwicklung zu Goldlegierungen
-Gold alloys are used in the form of welded wire or profile (also called weldtapes), segments, contact rivets, and stampings produced from clad strip
+Gold-Legierungen werden in Form von geschweißten Draht- und Profilabschnitten,
-materials. The selection of the bonding process is based on the cost for the joining process, and most importantly on the economical aspect of using the least possible amount of the expensive precious metal component.
+Kontaktnieten und plattierten Stanzteilen eingesetzt. Je nach konstruktiver
-Besides being used as switching contacts in relays and pushbuttons, gold alloys are also applied in the design of connectors as well as sliding contacts for potentiometers, sensors, slip rings, and brushes in miniature DC motors <xr id="tab:Application Examples and Forms of Gold and Gold Alloys"/><!--(Table 2.5)-->.
+Gold-Legierungen werden sowohl als schaltende Kontakte in Relais und Tasten,
 <figtable id="tab:Application Examples and Forms of Gold and Gold Alloys">
-<caption>'''<!--Table 2.5:-->Application Examples and Forms of Gold and Gold Alloys'''</caption>
+<caption>'''<!--Table 2.5:-->Anwendungsbeispiele und Anwendungsformen von Gold und Goldlegierungen'''</caption>
 <table class="twocolortable">