Testing of Contact Surface Layers - Revision history

Doduco Admin: /* Porosity */

2023-01-09T12:00:25Z

‎Porosity

Doduco Admin: /* Layer Thickness */

2023-01-09T11:59:04Z

‎Layer Thickness

Doduco Admin at 08:45, 8 December 2022

2022-12-08T08:45:33Z

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Doduco Admin at 07:35, 8 December 2022

2022-12-08T07:35:25Z

Teitscheid at 18:45, 22 September 2014

2014-09-22T18:45:11Z

Doduco Redaktion: /* Bondability */

2014-05-19T13:07:43Z

‎Bondability

Doduco Redaktion at 13:07, 19 May 2014

2014-05-19T13:07:07Z

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Doduco Redaktion at 14:31, 16 April 2014

2014-04-16T14:31:58Z

Doduco Redaktion: /* 13.2.3.3 Bondability */

2014-04-16T14:24:37Z

‎13.2.3.3 Bondability

Doduco Redaktion: /* 13.2.3.3 Bondability */

2014-04-16T14:24:05Z

‎13.2.3.3 Bondability

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 During the electrolytic test, a sample is immersed into an electrolyte, containing an indicator solution. After passing electrical current, the pores are visible as colored spots.
-Frequently a SO test at higher concentrations (100 ppm) and high humidity (2 levels, 95% RH at 40°C) is used. One advantage of this method is, that the severity level can be increased easily by varying the concentration of SO<sub>2</sub>. Besides these, other corrosive gas mixtures of H<sub>2</sub>S, SO<sub>2</sub>, and NO<sub>2</sub> are used in porosity tests (i.e. tests according to ASTM B735 and B 799).
+Frequently a SO test at higher concentrations (100 ppm) and high humidity (2 levels, 95% RH at 40°C) is used. One advantage of this method is that the severity level can be increased easily by varying the concentration of SO<sub>2</sub>. Besides these, other corrosive gas mixtures of H<sub>2</sub>S, SO<sub>2</sub>, and NO<sub>2</sub> are used in porosity tests (i.e. tests according to ASTM B735 and B 799).
 ====<!--13.2.1.3-->Hardness====

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 The primary requirement on an electroplated deposit is its thickness, since a series of other properties such as porosity, hardness and ductility, are depending on the layer thickness. A widely used method for thickness measurement is the microscopical evaluation of a mounted micro
 section. Because of optical resolution limits however, layer thicknesses below 0.5 μm cannot be measured with sufficient accuracy. For low coating
-thicknesses the x-ray fluorescence method is used, which often is integrated for quality assurance into the manufacturing process, for example in selective reelto- reel electroplating plating lines. In this process, the returned characteristic x-ray impulses of the coating material and the substrate, generated by the primary x-rays, are detected and counted and then converted into material thickness by a computerized indicator or recording and control unit.
+thicknesses the x-ray fluorescence method is used, which often is integrated for quality assurance into the manufacturing process, for example in selective reel-to- reel electroplating plating lines. In this process, the returned characteristic x-ray impulses of the coating material and the substrate, generated by the primary x-rays, are detected and counted and then converted into material thickness by a computerized indicator or recording and control unit.
 ====<!--13.2.1.2-->Porosity====

@@ Line 1: / Line 1: @@
 ==<!--13.2-->Testing of Contact Surface Layers==
-For applications at low switching loads contact layers with thicknesses in the range of just a few micrometers are widely used. For testing such thin layers the actual coating properties must be distinguished from the functional properties. Coating properties include, besides others, porosity, hardness, and ductility. Depending on the application, the most important function properties are for example frictional wear, contact resistance, material transfer, or contact welding behavior. Besides these other technological properties such as adhesion strength, and solderability, maybe of importance for special applications like those for electronic components.
+For applications at low switching loads, contact layers with thicknesses in the range of just a few micrometers are widely used. For testing such thin layers, the actual coating properties must be distinguished from the functional properties. Coating properties include, besides others, porosity, hardness and ductility. Depending on the application, the most important function properties are for example frictional wear, contact resistance, material transfer or contact welding behavior. Besides these, other technological properties such as adhesion strength and solderability, may also be of importance for special applications like those for electronic components.
-The following descriptions are mainly applicable to electroplated contact coatings which are of the most economical importance in contact applications. They also apply however in similar form to surface layers which have been created by mechanical cladding or by sputtering.
+The following descriptions are mainly applicable to electroplated contact coatings, which are of the most economical importance in contact applications. They also apply however in similar form to surface layers, which have been created by mechanical cladding or by sputtering.
 ===<!--13.2.1-->Surface Layer Properties===

← Older revision		Revision as of 18:45, 22 September 2014
Line 116:		Line 116:
	==References==		==References==
	[[Testing Procedures#References\|References]]		[[Testing Procedures#References\|References]]
		+
		+	[[de:Prüfung_von_Kontaktschichten]]

@@ Line 96: / Line 96: @@
 The wire bonding – a welding process of fine wires onto flat semiconductors and metal surfaces – was developed for contacting semiconductor
-components (see Chapter [[Applications for Bonding Technologies|Applications for Bonding Technologies. ]]) Depending on the application the reliability of the bond connections over extended time periods under difficult environmental conditions is of great importance. The quality of such connections can only be evaluated in destructive pull or shear tests.
+components (see Chapter [[Applications for Bonding Technologies|Applications for Bonding Technologies]]) Depending on the application the reliability of the bond connections over extended time periods under difficult environmental conditions is of great importance. The quality of such connections can only be evaluated in destructive pull or shear tests.
 *Pull Test

← Older revision		Revision as of 14:31, 16 April 2014
Line 1:		Line 1:
−	===13.2.1===Surface Layer Properties	+	==13.2 Testing of Contact Surface Layers==
		+
		+	For applications at low switching loads contact layers with thicknesses in the range of just a few micrometers are widely used. For testing such thin layers the actual coating properties must be distinguished from the functional properties. Coating properties include, besides others, porosity, hardness, and ductility. Depending on the application, the most important function properties are for example frictional wear, contact resistance, material transfer, or contact welding behavior. Besides these other technological properties such as adhesion strength, and solderability, maybe of importance for special applications like those for electronic components.
		+
		+	The following descriptions are mainly applicable to electroplated contact coatings which are of the most economical importance in contact applications. They also apply however in similar form to surface layers which have been created by mechanical cladding or by sputtering.
		+
		+	===13.2.1 Surface Layer Properties===

	====13.2.1.1 Layer Thickness====		====13.2.1.1 Layer Thickness====

@@ Line 90: / Line 90: @@
 The wire bonding – a welding process of fine wires onto flat semiconductors and metal surfaces – was developed for contacting semiconductor
-components (see Chapter 9) [[Applications for Bonding Technologies|Applications for Bonding Technologies ]]. Depending on the application the reliability of the bond connections over extended time periods under difficult environmental conditions is of great importance. The quality of such connections can only be evaluated in destructive pull or shear tests.
+components (see Chapter 9) [[Applications for Bonding Technologies|Applications for Bonding Technologies. ]] Depending on the application the reliability of the bond connections over extended time periods under difficult environmental conditions is of great importance. The quality of such connections can only be evaluated in destructive pull or shear tests.
 *Pull Test