Gold Based Materials - Revision history

Doduco Admin at 07:46, 11 January 2023

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Doduco Admin at 08:26, 30 November 2022

2022-11-30T08:26:17Z

@@ Line 11: / Line 11: @@
 <table class="twocolortable">
-<tr><th><p class="s11">Designation</p></th><th><p class="s11">Composition Au</p><p class="s11">(min. content)</p></th><th><p class="s11">Impurites ppm</p></th><th><p class="s12">Remarks on forms and application</p></th></tr><tr><td><p class="s11">Electronic Glod</p><p class="s11">Gold</p></td><td><p class="s11">99.999</p></td><td><p class="s11">Cu &lt; 3</p><p class="s11">Ag &lt; 3</p><p class="s11">Ca &lt; 1</p><p class="s11">Mg &lt;1</p><p class="s11">Fe &lt; 1</p></td><td><p class="s12">Wires, strips, alloying metal for semiconductors,  electronic components</p></td></tr><tr><td><p class="s11">Pure Gold</p></td><td><p class="s11">99.995</p></td><td><p class="s11">Cu &lt; 10</p><p class="s11">Ag &lt; 15</p><p class="s11">Ca &lt; 20</p><p class="s11">Mg &lt; 10</p><p class="s11">Fe &lt; 3</p><p class="s11">Si &lt; 10</p><p class="s11">Pb &lt; 20</p></td><td><p class="s12">Granulate for high purity alloys, strips, tubing, profiles</p></td></tr><tr><td><p class="s11">Ingot Grade-Gold</p></td><td><p class="s11">99.95</p></td><td><p class="s11">Cu &lt; 100</p><p class="s11">Ag &lt; 150</p><p class="s11">Ca &lt; 50</p><p class="s11">Mg &lt; 50</p><p class="s11">Fe &lt; 30</p><p class="s11">Si &lt; 10</p></td><td><p class="s12">Alloys, commonly used grade</p></td></tr></table>
+<tr><th><p class="s11">Designation</p></th><th><p class="s11">Composition Au</p><p class="s11">(min. content)</p></th><th><p class="s11">Impurites ppm</p></th><th><p class="s12">Remarks on forms and application</p></th></tr><tr><td><p class="s11">Electronic Gold</p><p class="s11">Gold</p></td><td><p class="s11">99.999</p></td><td><p class="s11">Cu &lt; 3</p><p class="s11">Ag &lt; 3</p><p class="s11">Ca &lt; 1</p><p class="s11">Mg &lt;1</p><p class="s11">Fe &lt; 1</p></td><td><p class="s12">Wires, strips, alloying metal for semiconductors,  electronic components</p></td></tr><tr><td><p class="s11">Pure Gold</p></td><td><p class="s11">99.995</p></td><td><p class="s11">Cu &lt; 10</p><p class="s11">Ag &lt; 15</p><p class="s11">Ca &lt; 20</p><p class="s11">Mg &lt; 10</p><p class="s11">Fe &lt; 3</p><p class="s11">Si &lt; 10</p><p class="s11">Pb &lt; 20</p></td><td><p class="s12">Granulate for high purity alloys, strips, tubing, profiles</p></td></tr><tr><td><p class="s11">Ingot Grade-Gold</p></td><td><p class="s11">99.95</p></td><td><p class="s11">Cu &lt; 100</p><p class="s11">Ag &lt; 150</p><p class="s11">Ca &lt; 50</p><p class="s11">Mg &lt; 50</p><p class="s11">Fe &lt; 30</p><p class="s11">Si &lt; 10</p></td><td><p class="s12">Alloys, commonly used grade</p></td></tr></table>
 </figtable>
 <br/>

← Older revision		Revision as of 13:02, 20 December 2022
Line 1:		Line 1:

−	Pure Gold is besides Platinum the chemically most stable of all precious metals. In its pure form it is not very suitable for use as a contact material in electromechanical devices because of its tendency to stick and cold-weld at even low contact forces. In addition it is not hard or strong enough to resist mechanical wear and exhibits high material losses under electrical arcing loads <xr id="tab:Contact_and_Switching_Properties_of_Gold_and_Gold_Alloys"/><!--(Tab. 2.4)-->. This limits its use in form of thin electroplated or vacuum deposited layers.	+	Pure Gold is besides Platinum the chemically most stable of all precious metals. In its pure form it is not very suitable for use as a contact material in electromechanical devices because of its tendency to stick and cold-weld at even low contact forces. In addition it is not hard or strong enough to resist mechanical wear and exhibits high material losses under electrical arcing loads (<xr id="tab:Contact_and_Switching_Properties_of_Gold_and_Gold_Alloys"/>)<!--(Tab. 2.4)-->. This limits its use in form of thin electroplated or vacuum deposited layers.

	For most electrical contact applications, gold alloys are used. Depending on the alloying metal, the melting is performed either under a reducing atmosphere or in a vacuum. The choice of alloying metals depends on the intended use of the resulting contact material. The binary Au alloys with typically < 10 wt% of other precious metals such as Pt, Pd, Ag or non-precious metals like Ni, Co and Cu are the more commonly used ones (<xr id="tab:Physical Properties of Gold and Gold-Alloys"/>)<!--(Tab. 2.2)-->.		For most electrical contact applications, gold alloys are used. Depending on the alloying metal, the melting is performed either under a reducing atmosphere or in a vacuum. The choice of alloying metals depends on the intended use of the resulting contact material. The binary Au alloys with typically < 10 wt% of other precious metals such as Pt, Pd, Ag or non-precious metals like Ni, Co and Cu are the more commonly used ones (<xr id="tab:Physical Properties of Gold and Gold-Alloys"/>)<!--(Tab. 2.2)-->.

@@ Line 2: / Line 2: @@
 Pure Gold is besides Platinum the chemically most stable of all precious metals. In its pure form it is not very suitable for use as a contact material in electromechanical devices because of its tendency to stick and cold-weld at even low contact forces. In addition it is not hard or strong enough to resist mechanical wear and exhibits high material losses under electrical arcing loads <xr id="tab:Contact_and_Switching_Properties_of_Gold_and_Gold_Alloys"/><!--(Tab. 2.4)-->. This limits its use in form of thin electroplated or vacuum deposited layers.
-For most electrical contact applications, gold alloys are used. Depending on the alloying metal, the melting is performed either under a reducing atmosphere or in a vacuum. The choice of alloying metals depends on the intended use of the resulting contact material. The binary Au alloys with typically < 10 wt% of other precious metals such as Pt, Pd, Ag or non-precious metals like Ni, Co and Cu are the more commonly used ones <xr id="tab:Physical_Properties_of_Gold_and_Gold_Alloys"/><!--(Tab. 2.2)-->.
+For most electrical contact applications, gold alloys are used. Depending on the alloying metal, the melting is performed either under a reducing atmosphere or in a vacuum. The choice of alloying metals depends on the intended use of the resulting contact material. The binary Au alloys with typically < 10 wt% of other precious metals such as Pt, Pd, Ag or non-precious metals like Ni, Co and Cu are the more commonly used ones (<xr id="tab:Physical Properties of Gold and Gold-Alloys"/>)<!--(Tab. 2.2)-->.
-On one hand these alloy additions improve the mechanical strength and electrical switching properties but on the other hand reduce the electrical conductivity and chemical corrosion resistance <xr id="fig:Influence_of_1_10_atomic_of_different"/><!--(Fig. 2.2)--> to varying degrees.
+On one hand these alloy additions improve the mechanical strength and electrical switching properties but on the other hand reduce the electrical conductivity and chemical corrosion resistance (<xr id="fig:Influence_of_1_10_atomic_of_different"/>)<!--(Fig. 2.2)--> to varying degrees.
-Under the aspect of reducing the gold content, ternary alloys with a gold content of approximately 70 wt% and additions of Ag and Cu or Ag and Ni resp., for example AuAg25Cu5 or AuAg20Cu10 are used, which exhibit for many applications good mechanical stability, while at the same time have sufficient resistance against the formation of corrosion layers <xr id="tab:Mechanical Properties of Gold and Gold-Alloys"/><!--(Table 2.3)-->.
+Under the aspect of reducing the gold content, ternary alloys with a gold content of approximately 70 wt% and additions of Ag and Cu or Ag and Ni resp., for example AuAg25Cu5 or AuAg20Cu10 are used, which exhibit for many applications good mechanical stability, while at the same time have sufficient resistance against the formation of corrosion layers (<xr id="tab:Mechanical Properties of Gold and Gold-Alloys"/>)<!--(Table 2.3)-->.
 <figtable id="tab:Commonly Used Grades of Gold">
@@ Line 246: / Line 246: @@
 </figtable>
-Other ternary alloys based on the AuAg system are AuAg26Ni3 and AuAg25Pt6. These alloys are mechanically similar to the AuAgCu alloys but have significantly higher oxidation resistance at elevated temperatures <xr id="tab:Contact_and_Switching_Properties_of_Gold_and_Gold_Alloys"/><!--(Table 2.4)-->.
+Other ternary alloys based on the AuAg system are AuAg26Ni3 and AuAg25Pt6. These alloys are mechanically similar to the AuAgCu alloys but have significantly higher oxidation resistance at elevated temperatures (<xr id="tab:Contact_and_Switching_Properties_of_Gold_and_Gold_Alloys"/>)<!--(Table 2.4)-->.
 <figtable id="tab:Contact_and_Switching_Properties_of_Gold_and_Gold_Alloys">
@@ Line 259: / Line 259: @@
 materials. The selection of the bonding process is based on the cost for the joining process and most importantly on the economical aspect of using the least possible amount of the expensive precious metal component.
-Besides being used as switching contacts in relays and pushbuttons, gold alloys are also applied in the design of connectors as well as sliding contacts for potentiometers, sensors, slip rings and brushes in miniature DC motors <xr id="tab:Application Examples and Forms of Gold and Gold Alloys"/><!--(Table 2.5)-->.
+Besides being used as switching contacts in relays and pushbuttons, gold alloys are also applied in the design of connectors as well as sliding contacts for potentiometers, sensors, slip rings and brushes in miniature DC motors (<xr id="tab:Application Examples and Forms of Gold and Gold Alloys"/>)<!--(Table 2.5)-->.
 <figtable id="tab:Application Examples and Forms of Gold and Gold Alloys">

@@ Line 155: / Line 155: @@
 <div class="multiple-images">
 <figure id="fig:Influence_of_1_10_atomic_of_different">
 [[File:Influence of 1-10 atomic of different.jpg|left|thumb|<caption>Fig 2.2 Influence of 1-10 atomic% of different alloying metals on the electrical resistivity of gold (according to J. O. Linde)</caption>]]

@@ Line 41: / Line 41: @@
 |79
 |-
-|Au 899,95)
+|AuAg8
-| >99,95
+|92
-|19,3
+|18,1
-|1064
+|1058
-|2,32
+|6,13
-|43
+|16,3
-|317
+|147
-|4,0
+|1,25
-|79
+|82
 |-
-|Au 899,95)
+|AuAg20
-| >99,95
+|80
-|19,3
+|16,4
-|1064
+|1035 - 1045
-|2,32
+|10,0
-|43
+|10
-|317
+|75
-|4,0
+|0,86
-|79
+|89
 |-
-|Au 899,95)
+|AuNi5
-| >99,95
+|95
-|19,3
+|18,3
-|1064
+|995 - 1018
-|2,32
+|13,5
-|43
+|7,4
-|317
+|53
-|4,0
+|0,71
-|79
+|83
 |-
-|Au 899,95)
+|AuCo5
-| >99,95
+|95
-|19,3
+|18,2
-|1064
+|1010 - 1015
-|2,32
+|55,6
-|43
+|1,8
-|317
-|4,0
+|0,68
-|79
+|88
 |-
-|Au 899,95)
+|AuCo5 (het.)
-| >99,95
+|95
-|19,3
+|18,2
-|1064
+|1010 - 1015
-|2,32
+|5,99
-|43
+|16,7
-|317
-|4,0
-|79
 |-
-|Au 899,95)
+|AuAg25Cu5
-| >99,95
+|70
-|19,3
+|15,2
-|1064
+|950 - 980
-|2,32
+|12,2
-|43
+|8,2
-|317
-|4,0
+|0,75
-|79
+|89
 |-
-|Au 899,95)
+|AuAg20C10
-| >99,95
+|70
-|19,3
+|15,1
-|1064
+|865 - 895
-|2,32
+|13,3
-|43
+|7,5
-|317
+|66
-|4,0
+|0,52
-|79
+|87
 |-
-|Au 899,95)
+|AuAg26Ni3
-| >99,95
+|71
-|19,3
+|15,4
-|1064
+|990 - 1020
-|2,32
+|11,0
-|43
+|9,1
-|317
+|59
-|4,0
+|0,88
-|79
+|114
 |-
-|Au 899,95)
+|AuPt10
-| >99,95
+|90
-|19,3
+|19,5
-|1064
+|1150 - 1190
-|2,32
+|12,5
-|43
+|8,0
-|317
+|54
-|4,0
-|79
 |-
-|Au 899,95)
+|AuAg25Pt6
-| >99,95
+|69
-|19,3
+|16,1
-|1064
+|1060
-|2,32
+|15,9
-|43
+|6,3
-|317
+|46
-|4,0
+|0,54
-|79
+|93
 |-
-|Au 899,95)
+|AuCu14Pt9Ag4
-| >99,95
+|73
-|19,3
+|16,0
-|1064
+|955
-|2,32
+|14,3 - 25
-|43
+|4 - 7
-|317
-|4,0
-|79
 |-
 |}

@@ Line 29: / Line 29: @@
 !Modulus of<br/>Elasticity<br/>[GPa]
 |-
-|Au 899,95)
+|Au (99,95)
 | >99,95
 |19,3

← Older revision		Revision as of 12:47, 20 December 2022
Line 12:		Line 12:

	<tr><th><p class="s11">Designation</p></th><th><p class="s11">Composition Au</p><p class="s11">(min. content)</p></th><th><p class="s11">Impurites ppm</p></th><th><p class="s12">Remarks on forms and application</p></th></tr><tr><td><p class="s11">Electronic Glod</p><p class="s11">Gold</p></td><td><p class="s11">99.999</p></td><td><p class="s11">Cu < 3</p><p class="s11">Ag < 3</p><p class="s11">Ca < 1</p><p class="s11">Mg <1</p><p class="s11">Fe < 1</p></td><td><p class="s12">Wires, strips, alloying metal for semiconductors, electronic components</p></td></tr><tr><td><p class="s11">Pure Gold</p></td><td><p class="s11">99.995</p></td><td><p class="s11">Cu < 10</p><p class="s11">Ag < 15</p><p class="s11">Ca < 20</p><p class="s11">Mg < 10</p><p class="s11">Fe < 3</p><p class="s11">Si < 10</p><p class="s11">Pb < 20</p></td><td><p class="s12">Granulate for high purity alloys, strips, tubing, profiles</p></td></tr><tr><td><p class="s11">Ingot Grade-Gold</p></td><td><p class="s11">99.95</p></td><td><p class="s11">Cu < 100</p><p class="s11">Ag < 150</p><p class="s11">Ca < 50</p><p class="s11">Mg < 50</p><p class="s11">Fe < 30</p><p class="s11">Si < 10</p></td><td><p class="s12">Alloys, commonly used grade</p></td></tr></table>		<tr><th><p class="s11">Designation</p></th><th><p class="s11">Composition Au</p><p class="s11">(min. content)</p></th><th><p class="s11">Impurites ppm</p></th><th><p class="s12">Remarks on forms and application</p></th></tr><tr><td><p class="s11">Electronic Glod</p><p class="s11">Gold</p></td><td><p class="s11">99.999</p></td><td><p class="s11">Cu < 3</p><p class="s11">Ag < 3</p><p class="s11">Ca < 1</p><p class="s11">Mg <1</p><p class="s11">Fe < 1</p></td><td><p class="s12">Wires, strips, alloying metal for semiconductors, electronic components</p></td></tr><tr><td><p class="s11">Pure Gold</p></td><td><p class="s11">99.995</p></td><td><p class="s11">Cu < 10</p><p class="s11">Ag < 15</p><p class="s11">Ca < 20</p><p class="s11">Mg < 10</p><p class="s11">Fe < 3</p><p class="s11">Si < 10</p><p class="s11">Pb < 20</p></td><td><p class="s12">Granulate for high purity alloys, strips, tubing, profiles</p></td></tr><tr><td><p class="s11">Ingot Grade-Gold</p></td><td><p class="s11">99.95</p></td><td><p class="s11">Cu < 100</p><p class="s11">Ag < 150</p><p class="s11">Ca < 50</p><p class="s11">Mg < 50</p><p class="s11">Fe < 30</p><p class="s11">Si < 10</p></td><td><p class="s12">Alloys, commonly used grade</p></td></tr></table>
		+	</figtable>
		+
		+	<figtable id="tab:Physical Properties of Gold and Gold-Alloys">
		+	<caption>'''Physical Properties of Gold and Gold-Alloys'''</caption>
		+
		+	{\| class="twocolortable" style="text-align: left; font-size: 12px"
		+	\|-
		+	!Material
		+	!Gold<br/>Content<br/>[wt.%]
		+	!Density<br/>[g/cm<sup>3</sup>]
		+	!Melting Point<br/>or Range<br/>[°C]
		+	!Electrical<br/>Resistivity<br/>[µΩ*cm]
		+	!Electrical<br/>Conductivity<br/>[MS/m]
		+	!Thermal<br/>Conductivity<br/>[W/(m*K)]
		+	!Temp. Coeff. of<br/>the electr. Resistance<br/>[10<sup>-3<sup/>/K]
		+	!Modulus of<br/>Elasticity<br/>[GPa]
		+	\|-
		+	\|Au 899,95)
		+	\| >99,95
		+	\|19,3
		+	\|1064
		+	\|2,32
		+	\|43
		+	\|317
		+	\|4,0
		+	\|79
		+	\|-
		+	\|Au 899,95)
		+	\| >99,95
		+	\|19,3
		+	\|1064
		+	\|2,32
		+	\|43
		+	\|317
		+	\|4,0
		+	\|79
		+	\|-
		+	\|Au 899,95)
		+	\| >99,95
		+	\|19,3
		+	\|1064
		+	\|2,32
		+	\|43
		+	\|317
		+	\|4,0
		+	\|79
		+	\|-
		+	\|Au 899,95)
		+	\| >99,95
		+	\|19,3
		+	\|1064
		+	\|2,32
		+	\|43
		+	\|317
		+	\|4,0
		+	\|79
		+	\|-
		+	\|Au 899,95)
		+	\| >99,95
		+	\|19,3
		+	\|1064
		+	\|2,32
		+	\|43
		+	\|317
		+	\|4,0
		+	\|79
		+	\|-
		+	\|Au 899,95)
		+	\| >99,95
		+	\|19,3
		+	\|1064
		+	\|2,32
		+	\|43
		+	\|317
		+	\|4,0
		+	\|79
		+	\|-
		+	\|Au 899,95)
		+	\| >99,95
		+	\|19,3
		+	\|1064
		+	\|2,32
		+	\|43
		+	\|317
		+	\|4,0
		+	\|79
		+	\|-
		+	\|Au 899,95)
		+	\| >99,95
		+	\|19,3
		+	\|1064
		+	\|2,32
		+	\|43
		+	\|317
		+	\|4,0
		+	\|79
		+	\|-
		+	\|Au 899,95)
		+	\| >99,95
		+	\|19,3
		+	\|1064
		+	\|2,32
		+	\|43
		+	\|317
		+	\|4,0
		+	\|79
		+	\|-
		+	\|Au 899,95)
		+	\| >99,95
		+	\|19,3
		+	\|1064
		+	\|2,32
		+	\|43
		+	\|317
		+	\|4,0
		+	\|79
		+	\|-
		+	\|Au 899,95)
		+	\| >99,95
		+	\|19,3
		+	\|1064
		+	\|2,32
		+	\|43
		+	\|317
		+	\|4,0
		+	\|79
		+	\|-
		+	\|Au 899,95)
		+	\| >99,95
		+	\|19,3
		+	\|1064
		+	\|2,32
		+	\|43
		+	\|317
		+	\|4,0
		+	\|79
		+	\|-
		+	\|}
	</figtable>		</figtable>

← Older revision		Revision as of 12:35, 20 December 2022
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	<tr><th><p class="s11">Material</p></th><th><p class="s12">Application Examples</p></th><th><p class="s12">Form of Application</p></th></tr><tr><td><p class="s11">Pure Gold</p><p class="s11">(electroplated)</p></td><td><p class="s12">Corrosion protection layer for contact parts, stationary contacts, bonding surfaces</p></td><td><p class="s12">Electroplated coatings, bond surface layers</p></td></tr><tr><td><p class="s11">Hard Gold</p><p class="s11">(sputtered)</p></td><td><p class="s12">Contact parts for connectors and switches, sliding contact tracks, bonding surfaces</p></td><td><p class="s12">Electroplated coatings on contact rivets and stamped parts</p></td></tr><tr><td><p class="s11">Hard Gold</p><p class="s11">(sputtered)</p></td><td><p class="s12">Contacts in switches and relays for low loads, electronic signal relays</p></td><td><p class="s12">Contact surface layer on miniature</p><p class="s12">profiles (weld tapes)</p></td></tr><tr><td><p class="s11">AuAg8</p></td><td><p class="s12">Dry circuit switching contacts, electronic</p><p class="s12">signal relays</p></td><td><p class="s12">Contact rivets, welded contact</p><p class="s12">parts</p></td></tr><tr><td><p class="s11">AuAg20</p></td><td><p class="s12">Switching contacts for low loads, electronic</p><p class="s12">signal relays</p></td><td><p class="s12">Contact rivets, welded contact</p><p class="s12">parts</p></td></tr><tr><td><p class="s11">AuAg25Cu5</p><p class="s11">AuAg25Cu10</p><p class="s11">AuAg26Ni3</p></td><td><p class="s12">Contact parts for connectors, switches and relays</p></td><td><p class="s12">Claddings on Cu alloys, contact rivets, contact layer on micro profiles (weld tapes)</p></td></tr><tr><td><p class="s11">AuNi5</p><p class="s11">AuCo5 (heterogen)</p></td><td><p class="s12">Contacts in switches and relays for low and medium loads, material transfer resistant contacts</p></td><td><p class="s12">Contact rivets, welded contact parts, contact layer on miniature profiles (weld tapes)</p></td></tr><tr><td><p class="s11">AuPt10</p><p class="s11">AuAg25Pt6</p></td><td><p class="s12">Contacts for highest chemical corrosion resistance in switches and relays</p></td><td><p class="s12">Contact rivets, contact layer on micro profiles (weld tapes)</p></td></tr><tr><td><p class="s11">AuCu14Pt9Ag4</p></td><td><p class="s12">Sliding contacts for measurement data transfer</p></td><td><p class="s12">Wire-formed parts</p></td></tr></table>		<tr><th><p class="s11">Material</p></th><th><p class="s12">Application Examples</p></th><th><p class="s12">Form of Application</p></th></tr><tr><td><p class="s11">Pure Gold</p><p class="s11">(electroplated)</p></td><td><p class="s12">Corrosion protection layer for contact parts, stationary contacts, bonding surfaces</p></td><td><p class="s12">Electroplated coatings, bond surface layers</p></td></tr><tr><td><p class="s11">Hard Gold</p><p class="s11">(sputtered)</p></td><td><p class="s12">Contact parts for connectors and switches, sliding contact tracks, bonding surfaces</p></td><td><p class="s12">Electroplated coatings on contact rivets and stamped parts</p></td></tr><tr><td><p class="s11">Hard Gold</p><p class="s11">(sputtered)</p></td><td><p class="s12">Contacts in switches and relays for low loads, electronic signal relays</p></td><td><p class="s12">Contact surface layer on miniature</p><p class="s12">profiles (weld tapes)</p></td></tr><tr><td><p class="s11">AuAg8</p></td><td><p class="s12">Dry circuit switching contacts, electronic</p><p class="s12">signal relays</p></td><td><p class="s12">Contact rivets, welded contact</p><p class="s12">parts</p></td></tr><tr><td><p class="s11">AuAg20</p></td><td><p class="s12">Switching contacts for low loads, electronic</p><p class="s12">signal relays</p></td><td><p class="s12">Contact rivets, welded contact</p><p class="s12">parts</p></td></tr><tr><td><p class="s11">AuAg25Cu5</p><p class="s11">AuAg25Cu10</p><p class="s11">AuAg26Ni3</p></td><td><p class="s12">Contact parts for connectors, switches and relays</p></td><td><p class="s12">Claddings on Cu alloys, contact rivets, contact layer on micro profiles (weld tapes)</p></td></tr><tr><td><p class="s11">AuNi5</p><p class="s11">AuCo5 (heterogen)</p></td><td><p class="s12">Contacts in switches and relays for low and medium loads, material transfer resistant contacts</p></td><td><p class="s12">Contact rivets, welded contact parts, contact layer on miniature profiles (weld tapes)</p></td></tr><tr><td><p class="s11">AuPt10</p><p class="s11">AuAg25Pt6</p></td><td><p class="s12">Contacts for highest chemical corrosion resistance in switches and relays</p></td><td><p class="s12">Contact rivets, contact layer on micro profiles (weld tapes)</p></td></tr><tr><td><p class="s11">AuCu14Pt9Ag4</p></td><td><p class="s12">Sliding contacts for measurement data transfer</p></td><td><p class="s12">Wire-formed parts</p></td></tr></table>
	</figtable>		</figtable>
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−	~~<xr id="fig:Phase diagram of goldplatinum"/> Fig. 2.3: Phase diagram of goldplatinum~~
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−	~~<xr id="fig:Phase diagram of gold-silver"/> Fig. 2.4: Phase diagram of gold-silver~~
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−	~~<xr id="fig:Phase diagram of gold-copper"/> Fig. 2.5: Phase diagram of gold-copper~~
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−	~~<xr id="fig:Phase diagram of gold-nickel"/> Fig. 2.6: Phase diagram of gold-nickel~~
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−	~~<xr id="fig:Phase diagram of gold-cobalt"/> Fig. 2.7: Phase diagram of gold-cobalt~~
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−	~~<xr id="fig:Strain hardening of Au by cold working"/> Fig. 2.8: Strain hardening of Au by cold working~~
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−	~~<xr id="fig:Softening of Au after annealing for 0.5 hrs"/> Fig. 2.9: Softening of Au after annealing for 0.5 hrs after 80% cold working~~
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−	~~<xr id="fig:Strain hardening of AuPt10 by cold working"/> Fig. 2.10: Strain hardening of AuPt10 by cold working~~
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−	~~<xr id="fig:Strain hardening of AuAg20 by cold working"/> Fig. 2.11: Strain hardening of AuAg20 by cold working~~
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−	~~<xr id="fig:Strain hardening of AuAg30 by cold working"/> Fig. 2.12: Strain hardening of AuAg30 by cold working~~
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−	~~<xr id="fig:Strain hardening of AuNi5 by cold working"/> Fig. 2.13: Strain hardening of AuNi5 by cold working~~
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−	~~<xr id="fig:Softening of AuNi5 after annealing for 0.5 hrs"/> Fig. 2.14: Softening of AuNi5 after annealing for 0.5 hrs after 80% cold working~~
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−	~~<xr id="fig:Strain hardening of AuCo5 by cold working"/> Fig. 2.15: Strain hardening of AuCo5 by cold working~~
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−	~~<xr id="fig:Precipitation hardening of AuCo5 at"/> Fig. 2.16: Precipitation hardening of AuCo5 at 400°C hardening temperature~~
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−	~~<xr id="fig:Strain hardening of AuAg25Pt6 by cold working"/> Fig. 2.17: Strain hardening of AuAg25Pt6 by cold working~~
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−	~~<xr id="fig:Strain hardening of AuAg26Ni3 by cold working"/> Fig. 2.18: Strain hardening of AuAg26Ni3 by cold working~~
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−	~~<xr id="fig:Softening of AuAg26Ni3 after annealing for 0.5-hrs"/> Fig. 2.19: Softening of AuAg26Ni3 after annealing for 0.5 hrs after 80% cold working~~
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−	~~<xr id="fig:Strain hardening of AuAg25Cu5 by cold working"/> Fig. 2.20: Strain hardening of AuAg25Cu5 by cold working~~
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−	~~<xr id="fig:Strain hardening of AuAg20Cu10 by cold working"/> Fig. 2.21: Strain hardening of AuAg20Cu10 by cold working~~
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−	~~<xr id="fig:Softening of AuAg20Cu10 after annealing for 0.5 hrs"/> Fig. 2.22: Softening of AuAg20Cu10 after annealing for 0.5 hrs after 80% cold working~~
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−	~~<xr id="fig:Strain hardening of AuCu14Pt9Ag4 by cold working"/> Fig. 2.23: Strain hardening of AuCu14Pt9Ag4 by cold working~~
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−	~~<xr id="fig:Precipitation hardening of AuCu14Pt9Ag4"/> Fig. 2.24: Precipitation hardening of AuCu14Pt9Ag4 at different hardening temperatures after 50% cold working~~
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-Pure Gold is besides Platinum the chemically most stable of all precious metals. In its pure form it is not very suitable for use as a contact material in electromechanical devices because of its tendency to stick and cold-weld at even low contact forces. In addition it is not hard or strong enough to resist mechanical wear and exhibits high materials losses under electrical arcing loads <xr id="tab:Contact_and_Switching_Properties_of_Gold_and_Gold_Alloys"/><!--(Tab. 2.4)-->. This limits its use in form of thin electroplated or vacuum deposited layers.
+Pure Gold is besides Platinum the chemically most stable of all precious metals. In its pure form it is not very suitable for use as a contact material in electromechanical devices because of its tendency to stick and cold-weld at even low contact forces. In addition it is not hard or strong enough to resist mechanical wear and exhibits high material losses under electrical arcing loads <xr id="tab:Contact_and_Switching_Properties_of_Gold_and_Gold_Alloys"/><!--(Tab. 2.4)-->. This limits its use in form of thin electroplated or vacuum deposited layers.
-For most electrical contact applications gold alloys are used. Depending on the alloying metal the melting is performed either under in a reducing atmosphere or in a vacuum. The choice of alloying metals depends on the intended use of the resulting contact material. The binary Au alloys with typically < 10 wt% of other precious metals such as Pt, Pd, or Ag or non-precious metals like Ni, Co, and Cu are the more commonly used ones <xr id="tab:Physical_Properties_of_Gold_and_Gold_Alloys"/><!--(Tab. 2.2)-->.
+For most electrical contact applications, gold alloys are used. Depending on the alloying metal, the melting is performed either under a reducing atmosphere or in a vacuum. The choice of alloying metals depends on the intended use of the resulting contact material. The binary Au alloys with typically < 10 wt% of other precious metals such as Pt, Pd, Ag or non-precious metals like Ni, Co and Cu are the more commonly used ones <xr id="tab:Physical_Properties_of_Gold_and_Gold_Alloys"/><!--(Tab. 2.2)-->.
 On one hand these alloy additions improve the mechanical strength and electrical switching properties but on the other hand reduce the electrical conductivity and chemical corrosion resistance <xr id="fig:Influence_of_1_10_atomic_of_different"/><!--(Fig. 2.2)--> to varying degrees.
-Under the aspect of reducing the gold content ternary alloys with a gold content of approximately 70 wt% and additions of Ag and Cu or Ag and Ni resp., for example AuAg25Cu5 or AuAg20Cu10 are used which exhibit for many applications good mechanical stability while at the same time have sufficient resistance against the formation of corrosion layers <xr id="tab:Mechanical Properties of Gold and Gold-Alloys"/><!--(Table 2.3)-->.
+Under the aspect of reducing the gold content, ternary alloys with a gold content of approximately 70 wt% and additions of Ag and Cu or Ag and Ni resp., for example AuAg25Cu5 or AuAg20Cu10 are used, which exhibit for many applications good mechanical stability, while at the same time have sufficient resistance against the formation of corrosion layers <xr id="tab:Mechanical Properties of Gold and Gold-Alloys"/><!--(Table 2.3)-->.
 <figtable id="tab:Commonly Used Grades of Gold">
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 </figtable>
-Caused by higher gold prices over the past years the development of alloys with further reduced gold content had a high priority. The starting point has been the AuPd system which has continuous solubility of the two components. Besides the binary alloy of AuPd40 and the ternary one AuPd35Ag9 other multiple component alloys were developed. These alloys typically have < 50 wt% Au and often can be solution hardened in order to obtain even higher hardness and tensile strength. They are mostly used in sliding contact applications.
+Caused by higher gold prices over the past years, the development of alloys with further reduced gold content had a high priority. The starting point has been the AuPd system, which has continuous solubility of the two components. Besides the binary alloy of AuPd40 and the ternary one AuPd35Ag9, other multiple component alloys were developed. These alloys typically have < 50 wt% Au and often can be solution hardened in order to obtain even higher hardness and tensile strength. They are mostly used in sliding contact applications.
-Gold alloys are used in the form of welded wire or profile (also called weldtapes), segments, contact rivets, and stampings produced from clad strip
+Gold alloys are used in the form of welded wire or profile (also called weldtapes), segments, contact rivets and stampings produced from clad strip
-materials. The selection of the bonding process is based on the cost for the joining process, and most importantly on the economical aspect of using the least possible amount of the expensive precious metal component.
+materials. The selection of the bonding process is based on the cost for the joining process and most importantly on the economical aspect of using the least possible amount of the expensive precious metal component.
-Besides being used as switching contacts in relays and pushbuttons, gold alloys are also applied in the design of connectors as well as sliding contacts for potentiometers, sensors, slip rings, and brushes in miniature DC motors <xr id="tab:Application Examples and Forms of Gold and Gold Alloys"/><!--(Table 2.5)-->.
+Besides being used as switching contacts in relays and pushbuttons, gold alloys are also applied in the design of connectors as well as sliding contacts for potentiometers, sensors, slip rings and brushes in miniature DC motors <xr id="tab:Application Examples and Forms of Gold and Gold Alloys"/><!--(Table 2.5)-->.
 <figtable id="tab:Application Examples and Forms of Gold and Gold Alloys">