Wiki der elektrischen Kontakte

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Willkommen in der neuen Wiki der elektrischen Kontakte

Die Grundlage dieser Wiki ist die 2012er Ausgabe des "DODUCO Datenbuch der elektrischen Kontakte", welches auch in gedruckter Form erhältlich ist.
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Für weitere Fragen oder Hilfe kontaktieren Sie uns bitte direkt unter DODUCO Kontakt


Zufälliger Artikel

Applications for Bonding Technologies

Wire Bonding

Wire bonding is the manufacturing process for creating metallurgical bond connections between a thin wire (12.5 – 50 µm for gold fine-wires and 150 – 500 µm for aluminum thick-wires) and a suitably coated circuit carrier through friction welding. In principle, this method consists of pressure welding with the help of ultrasound. The metallurgical bond is mainly caused by frictional heat, created through the relative movement between the two bonding partner materials. To achieve high reliability over longer time and ...

Zufällige Dateien

Micro structure of W Cu 70 30 H.jpg
Micro structure of W/Cu 70/30 H

by Doduco Redaktion


Rough flat surface.jpg
Rough flat surface. a) before and b) during making contact with an ideally smooth flat surface; c) Schematic of the apparent, load bearing and effective contact areas (not to scale; dashed lines are elevation lines)
Pages: Application Tables and Guideline Data for Use of Electrical Contact Design,
Anwendungstabellen und Richtwerte für den Einsatz elektrischer Kontakte

by Doduco Redaktion