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→Coatings from the Gaseous Phase (Vacuum Deposition)
<figure id="fig:Principle of sputtering">
[[File:Principle of sputtering.jpg|right|thumb|Figure 1: Principle of sputtering Ar = Argon atoms; e = Electrons; M = Metal atoms]]
</figure>
Initially, a gas discharge is ignited in a low pressure (10<sup>-1</sup> -1 Pa) argon atmosphere. The argon ions generated, are accelerated in an electric field and impact the target of material to be deposited with high energy. Caused by this energy, atoms are released from the target material which condensate on the oppositely arranged anode (the substrate) and form a layer with high adhesion strength. Through an overlapping magnetic field at the target location, the deposition rate can be increased, making the process more economical.