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Silver Based Materials

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Hard-Silver Alloys
Using copper as an alloying component increases the mechanical stability of silver significantly. The most important among the binary AgCu alloys is that of AgCu3, known in europe also under the name of hard-silver. This material still has a chemical corrosion resistance close to that of fine silver. In comparison to pure silver and fine-grain silver AgCu3 exhibits increased mechanical strength as well as higher arc erosion resistance and mechanical wear resistance <xr id="tab:tab2.14"/> (Table 2.14).
Increasing the Cu content further also increases the mechanical strength of AgCu alloys and improves arc erosion resistance and resistance against material transfer while at the same time however the tendency to oxide formation becomes detrimental. This causes during switching under arcing conditions an increase in contact resistance with rising numbers of operation. In special applications where highest mechanical strength is recommended and a reduced chemical resistance can be tolerated, the eutectic AgCu alloy with 28 wt% of copper ''<xr id="fig:fig2.52"/> (Fig. 2.52)'' is used. AgCu10 also known as coin silver has been replaced in many applications by composite silver-based materials while sterling silver (AgCu7.5) has never extended its important usage from decorative table wear and jewelry to industrial applications in electrical contacts.
Besides these binary alloys, ternary AgCuNi alloys are used in electrical contact applications. From this group the material ARGODUR 27, an alloy of 98 wt% Ag with a 2 wt% Cu and nickel addition has found practical importance close to that of AgCu3. This material is characterized by high resistance to oxidation and low tendency to re-crystallization during exposure to high temperatures. Besides high mechanical stability this AgCuNi alloy also exhibits a strong resistance against arc erosion. Because of its high resistance against material transfer the alloy AgCu24.5Ni0.5 has been used in the automotive industry for an extended time in the North American market. Caused by miniaturization and the related reduction in available contact forces in relays and switches this material has been replaced widely because of its tendency to oxide formation.