Open main menu

Electrical Contacts β

Changes

Applications for Bonding Technologies

5 bytes removed, 13:42, 10 January 2023
Electroless Metal Deposition on Printed Circuit Boards
</figure>
<div class="clear"></div>
*'''Materials'''
{| class="twocolortable" style="text-align: left; font-size: 12px;width:35%"
|}
*'''Dimensions (typical values)'''
[[File:Dimensions typical-values.jpg|left|Dimensions (typical values)]]
<div class="clear"></div>
*'''Quality Criteria and Tolerances'''
Mechanical strength and dimensional tolerances for AlSi clad strips mostly follow the standards EN 1652, EN 1654, and EN 1758 for Cu and Cu alloys. Depending on the end application the following parameters for the coating layer are tested for and documented during manufacturing:
==Electroless Metal Deposition on Printed Circuit Boards==
Printed circuit boards are also used as circuit carriers. Since many of the conductive structures on the PCB are not electrically connected, the final surface coatings are produced using an electroless process (<xr id="fig:Electroless deposition on a printed circuit board"/>). (Chapter [[Electroless_Plating|Electroless Plating]]). Besides bonding to Nickel/Gold surfaces, soldering is the most widely used process to create conductive connections. This can also be performed on electroless deposited tin surface coatings.
<figure id="fig:Electroless deposition on a printed circuit board">